| Year |
Citation |
Score |
| 2020 |
Hadian F, Schoeller H, Cotts E. Correlation Between the Growth of Voids and Ni 3 Sn 4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C Journal of Electronic Materials. 49: 226-240. DOI: 10.1007/S11664-019-07727-0 |
0.504 |
|
| 2017 |
Mutuku F, Arfaei B, Cotts EJ. The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints Journal of Electronic Materials. 46: 2067-2079. DOI: 10.1007/S11664-016-5130-0 |
0.782 |
|
| 2015 |
Arfaei B, Mutuku F, Coyle R, Cotts E, Wilcox J. Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology Proceedings - Electronic Components and Technology Conference. 2015: 118-126. DOI: 10.1109/ECTC.2015.7159580 |
0.781 |
|
| 2015 |
Cotts E, Arfaei B. Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging Jom. 67: 2381-2382. DOI: 10.1007/S11837-015-1597-Z |
0.699 |
|
| 2014 |
Mutuku F, Arfaei B, Cotts EJ. Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys Proceedings - Electronic Components and Technology Conference. 1769-1775. DOI: 10.1109/ECTC.2014.6897538 |
0.747 |
|
| 2014 |
Parks G, Lu M, Perfecto E, Cotts E. Controlling the Sn grain morphology of SnAg C4 solder bumps Proceedings - Electronic Components and Technology Conference. 690-696. DOI: 10.1109/ECTC.2014.6897359 |
0.47 |
|
| 2014 |
Arfaei B, Mutuku F, Sweatman K, Lee NC, Cotts E, Coyle R. Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish Proceedings - Electronic Components and Technology Conference. 655-665. DOI: 10.1109/ECTC.2014.6897356 |
0.789 |
|
| 2014 |
Parks G, Faucett A, Fox C, Smith J, Cotts E. The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities Jom. 66: 2311-2319. DOI: 10.1007/S11837-014-1161-2 |
0.527 |
|
| 2014 |
Schoeller H, Anselm M, Khan I, Cotts E. Effect of Sn component surface finish on 92.5Pb-5Sn-2.5Ag International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 144-151. |
0.348 |
|
| 2013 |
Arfaei B, Mahin-Shirazi S, Joshi S, Anselm M, Borgesen P, Cotts E, Wilcox J, Coyle R. Reliability and failure mechanism of solder joints in thermal cycling tests Proceedings - Electronic Components and Technology Conference. 976-985. DOI: 10.1109/ECTC.2013.6575693 |
0.749 |
|
| 2013 |
Arfaei B, Benedict M, Cotts EJ. Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints Journal of Applied Physics. 114. DOI: 10.1063/1.4826437 |
0.766 |
|
| 2012 |
Arfaei B, Wentlent L, Joshi S, Alazzam A, Tashtoush T, Halaweh M, Chivukula S, Yin L, Meilunas M, Cotts E, Borgesen P. Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 392-398. DOI: 10.1109/ITHERM.2012.6231456 |
0.756 |
|
| 2012 |
Parks G, Arfaei B, Benedict M, Cotts E, Lu M, Perfecto E. The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry Proceedings - Electronic Components and Technology Conference. 703-709. DOI: 10.1109/ECTC.2012.6248909 |
0.746 |
|
| 2012 |
Arfaei B, Kim N, Cotts EJ. Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature Journal of Electronic Materials. 41: 362-374. DOI: 10.1007/S11664-011-1756-0 |
0.787 |
|
| 2011 |
Arfaei B, Tashtoush T, Kim N, Wentlent L, Cotts E, Borgesen P. Dependence of SnAgCu solder joint properties on solder microstructure Proceedings - Electronic Components and Technology Conference. 125-132. DOI: 10.1109/ECTC.2011.5898502 |
0.764 |
|
| 2011 |
Rae DF, Borgesen P, Cotts EJ. The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines Jom. 63: 78-84. DOI: 10.1007/S11837-011-0180-5 |
0.418 |
|
| 2011 |
Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N. Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Journal of Applied Electrochemistry. 41: 469-480. DOI: 10.1007/S10800-011-0257-4 |
0.437 |
|
| 2010 |
Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N. Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3271129 |
0.474 |
|
| 2010 |
Lehman LP, Xing Y, Bieler TR, Cotts EJ. Erratum to “Cyclic twin nucleation in tin based solder alloys” [Acta Materialia 58 (2010) 3546–3556] Acta Materialia. 58. DOI: 10.1016/J.Actamat.2010.04.047 |
0.311 |
|
| 2010 |
Lehman LP, Xing Y, Bieler TR, Cotts EJ. Cyclic twin nucleation in tin-based solder alloys Acta Materialia. 58: 3546-3556. DOI: 10.1016/J.Actamat.2010.01.030 |
0.439 |
|
| 2009 |
Yin L, Kondos P, Borgesen P, Liu Y, Bliznakov S, Wafula F, Dimitrov N, Henderson DW, Parks C, Gao M, Therriault J, Wang J, Cotts E. Controlling Cu electroplating to prevent sporadic voiding in Cu 3Sn Proceedings - Electronic Components and Technology Conference. 406-414. DOI: 10.1109/ECTC.2009.5074046 |
0.38 |
|
| 2009 |
Venkatadri V, Yin L, Xing Y, Cotts E, Srihari K, Borgesen P. Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion Proceedings - Electronic Components and Technology Conference. 398-405. DOI: 10.1109/ECTC.2009.5074045 |
0.397 |
|
| 2009 |
Arfaei B, Cotts E. Correlations between the microstructure and fatigue life of near-eutectic Sn-Ag-Cu Pb-free solders Journal of Electronic Materials. 38: 2617-2627. DOI: 10.1007/S11664-009-0932-Y |
0.785 |
|
| 2008 |
Fullem TZ, Cotts EJ. Thermal conductivity of thermal interface materials Materials Research Society Symposium Proceedings. 1053: 17-22. DOI: 10.1557/Proc-1053-Ee05-08 |
0.772 |
|
| 2008 |
Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Bliznakov S, Cotts EJ, Dimitrov N. Improving copper electrodeposition in the microelectronics industry Proceedings - Electronic Components and Technology Conference. 2105-2110. DOI: 10.1109/Tcapt.2009.2020172 |
0.5 |
|
| 2008 |
Bieler TR, Jiang H, Lehman LP, Kirkpatrick T, Cotts EJ, Nandagopal B. Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints Ieee Transactions On Components and Packaging Technologies. 31: 370-381. DOI: 10.1109/Tcapt.2008.916835 |
0.467 |
|
| 2008 |
Fullem TZ, Rae DF, Sharma A, Wolcott JA, Cotts EJ. Thermal characterization of thermal interface material bondlines 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 174-179. DOI: 10.1109/ITHERM.2008.4544268 |
0.777 |
|
| 2008 |
Arfaei B, Xing Y, Woods J, Wolcott J, Tumne P, Borgesen P, Cotts E. The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 459-465. DOI: 10.1109/ECTC.2008.4550012 |
0.743 |
|
| 2008 |
Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N. Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface : PPPlating in acidic copper solution with and without polyethylene glycol Journal of Applied Electrochemistry. 38: 1695-1705. DOI: 10.1007/S10800-008-9618-Z |
0.473 |
|
| 2007 |
Borgesen P, Bieler T, Lehman LP, Cotts EJ. Pb-free solder: New materials considerations for microelectronics processing Mrs Bulletin. 32: 360-365. DOI: 10.1557/Mrs2007.236 |
0.425 |
|
| 2007 |
Park S, Dhakal R, Lehman L, Cotts EJ. Grain deformation and strain in board level SnAgCu solder interconnects under deep thermal cycling Ieee Transactions On Components and Packaging Technologies. 30: 178-185. DOI: 10.1109/Tcapt.2007.892101 |
0.378 |
|
| 2007 |
Fullem TZ, Lehman LP, Cotts EJ. Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors Ieee Nuclear Science Symposium Conference Record. 2: 1325-1328. DOI: 10.1109/NSSMIC.2007.4437245 |
0.739 |
|
| 2007 |
Park S, Dhakal R, Lehman L, Cotts E. Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading Acta Materialia. 55: 3253-3260. DOI: 10.1016/J.Actamat.2007.01.028 |
0.395 |
|
| 2007 |
Arfaei B, Benedict M, Cotts E. The nucleation kinetics of Sn in Sn-Ag-Cu solder joints: Relation to microstructure Materials Science and Technology Conference and Exhibition, Ms and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems". 5: 3358-3364. |
0.777 |
|
| 2005 |
Kinyanjui R, Lehman LP, Zavalij L, Cotts E. Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys Journal of Materials Research. 20: 2914-2918. DOI: 10.1557/Jmr.2005.0361 |
0.425 |
|
| 2005 |
Lehman LP, Kinyanjui RK, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681. |
0.809 |
|
| 2005 |
Park S, Dhakal R, Lehman L, Cotts E. Grain formation and intergrain stresses in a Sn-Ag-Cu solder ball Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1095-1100. |
0.34 |
|
| 2004 |
Henderson DW, Woods JJ, Gosselin TA, Bartelo J, King DE, Korhonen TM, Korhonen MA, Lehman LP, Cotts EJ, Kang SK, Lauro P, Shih DY, Goldsmith C, Puttlitz KJ. The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue Journal of Materials Research. 19: 1608-1612. DOI: 10.1557/Jmr.2004.0222 |
0.488 |
|
| 2004 |
Pitely S, Zavalij L, Zarembo S, Cotts EJ. Linear coefficients of thermal expansion of Au0.5Ni 0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4 Scripta Materialia. 51: 745-749. DOI: 10.1016/J.Scriptamat.2004.02.023 |
0.437 |
|
| 2004 |
Lehman LP, Athavale SN, Fullem TZ, Giamis AC, Kinyanjui RK, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439. DOI: 10.1007/S11664-004-0083-0 |
0.786 |
|
| 2004 |
Telang AU, Bieler TR, Lucas JP, Subramanian KN, Lehman LP, Xing Y, Cotts EJ. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys Journal of Electronic Materials. 33: 1412-1423. DOI: 10.1007/S11664-004-0081-2 |
0.47 |
|
| 2003 |
Lehman LP, Kinyanjui RK, Zavalij L, Zribi A, Cotts EJ. Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories Proceedings - Electronic Components and Technology Conference. 1215-1221. |
0.82 |
|
| 2002 |
Chromik RR, Zavalij L, Johnson MD, Cotts EJ. Calorimetric investigation of the formation of metastable silicides in Au/a-Si thin film multilayers Journal of Applied Physics. 91: 8992-8998. DOI: 10.1063/1.1432774 |
0.6 |
|
| 2002 |
Zavalij L, Zribi A, Chromik RR, Pitely S, Zavalij PY, Cotts EJ. Crystal structure of Au1-xNixSn4 intermetallic alloys Journal of Alloys and Compounds. 334: 79-85. DOI: 10.1016/S0925-8388(01)01780-7 |
0.789 |
|
| 2002 |
Zribi A, Kinyanjui R, Borgesen P, Zavalij L, Cotts EJ. Aspects of the structural evolution of lead-free solder joints Jom. 54: 38-40. DOI: 10.1007/Bf02701848 |
0.822 |
|
| 2002 |
Kinyanjui RK, Zribi A, Cotts EJ. Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate Proceedings - Electronic Components and Technology Conference. 161-167. |
0.807 |
|
| 2001 |
Zribi A, Borgesen P, Zavalij L, Cotts EJ. Growth of Cu-Ni-Sn alloys in Pb free CuSnAg solder/Au-Ni metallization reactions Materials Research Society Symposium - Proceedings. 652. DOI: 10.1557/Proc-652-Y8.10 |
0.836 |
|
| 2001 |
Zribi A, Clark A, Zavalij L, Borgesen P, Cotts EJ. The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure Journal of Electronic Materials. 30: 1157-1164. DOI: 10.1007/S11664-001-0144-6 |
0.825 |
|
| 2001 |
Zribi A, Zavalij L, Borgesen P, Primavera A, Westby G, Cotts EJ. The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronics joints Proceedings - Electronic Components and Technology Conference. 687-692. |
0.421 |
|
| 2001 |
Driscoll TE, Lehmann GL, Cotts EJ. Underfill encapsulant flow measured using capacitance measurement techniques Materials Research Society Symposium Proceedings. 682: 21-25. |
0.73 |
|
| 2000 |
Zribi A, Chromik RR, Presthus R, Teed K, Zavalij L, De Vita J, To Va J, Cotts EJ, Clum JA, Erich R, Primavera A, Westby G, Coyle RJ, Wenger GM. Solder metallization interdiffusion in microelectronic interconnects Ieee Transactions On Components and Packaging Technologies. 23: 383-387. DOI: 10.1109/6144.846778 |
0.521 |
|
| 2000 |
Chromik RR, Neils WK, Cotts EJ. Erratum: “Thermodynamic and kinetic study of solid state reactions in the Cu–Si system” [J. Appl. Phys. 86, 4273 (1999)] Journal of Applied Physics. 87: 4642-4642. DOI: 10.1063/1.373120 |
0.538 |
|
| 1999 |
Zribi A, Chromik RR, Presthus R, Clum J, Teed K, Zavalij L, De Vita J, Tova J, Cotts EJ. Solder metalization interdiffusion in microelectronic interconnects Proceedings - Electronic Components and Technology Conference. 451-457. DOI: 10.1109/6144.846778 |
0.818 |
|
| 1999 |
Chromik RR, Neils WK, Cotts EJ. Thermodynamic and kinetic study of solid state reactions in the Cu-Si system Journal of Applied Physics. 86: 4273-4281. DOI: 10.1063/1.371357 |
0.672 |
|
| 1999 |
Zribi A, Chromik RR, Presthus R, Clum J, Zavalij L, Cotts EJ. Effect of Au-intermetallic compounds on mechanical reliability of Sn-Pb/Au-Ni-Cu joints American Society of Mechanical Engineers, Eep. 26. |
0.676 |
|
| 1998 |
Chromik RR, Neils WK, Cotts EJ. Formation of Cu3Si from Cu/a-Si multilayers Materials Research Society Symposium - Proceedings. 481: 581-586. DOI: 10.1557/Proc-481-581 |
0.619 |
|
| 1997 |
Chromik RR, Cotts EJ. Thermodynamic and kinetic study of phase transformations in solder/metal systems Materials Research Society Symposium - Proceedings. 445: 31-36. DOI: 10.1557/Proc-445-31 |
0.586 |
|
| 1997 |
Jiang N, Clum JA, Chromik RR, Cotts EJ. Thermal expansion of several Sn-based intermetallic compounds Scripta Materialia. 37: 1851-1854. DOI: 10.1016/S1359-6462(97)00355-2 |
0.583 |
|
| 1997 |
Driscoll TE, Li PC, Lehmann GL, Cotts EJ. Investigation of the flow behavior of particulate filled fluids Materials Research Society Symposium - Proceedings. 445: 69-74. |
0.731 |
|
| 1997 |
Clum J, Cotts E, Jiang N. Summary of recent studies of the effect of processing on microstructure of some solder alloys Tms Annual Meeting. 137-143. |
0.308 |
|
| 1996 |
Chromik RR, Cotts EJ. Study of the kinetics and energetics of solid state reactions in Pd/Sn diffusion couples Materials Research Society Symposium - Proceedings. 398: 307-312. DOI: 10.1557/Proc-398-307 |
0.598 |
|
| 1996 |
Kasica RJ, Cotts EJ, Ahrens RG. Kinetics and thermodynamics of the formation of thin film titanium disilicide Materials Research Society Symposium - Proceedings. 398: 301-305. DOI: 10.1557/Proc-398-301 |
0.346 |
|
| 1996 |
Neils WK, Chromik RR, Dreyer KF, Grosman D, Cotts EJ. Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples Materials Research Society Symposium - Proceedings. 398: 313-318. DOI: 10.1063/1.114596 |
0.586 |
|
| 1995 |
Dreyer KF, Neils WK, Chromik RR, Grosman D, Cotts EJ. Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin-film diffusion couples Applied Physics Letters. 67: 2795. DOI: 10.1557/Proc-398-313 |
0.625 |
|
| 1990 |
Winters GE, Unruh KM, Swann CP, Patt ME, White BE, Cotts EJ. Solid-State Reactions in Multilayer Ni/Ti Thin Film Composites Mrs Proceedings. 205: 215. DOI: 10.1557/Proc-205-215 |
0.39 |
|
| 1990 |
White BE, Patt ME, Cotts EJ. A comparison by means of calorimetry of solid state interdiffusion reactions in Ni/Zr and Ni/Ti composites Journal of Applied Physics. 68: 1910-1913. DOI: 10.1063/1.346581 |
0.426 |
|
| 1990 |
Wong GC, Johnson WL, Cotts EJ. Solid state amorphization reactions in deformed Ni-Zr multilayered composites Journal of Materials Research. 5: 488-497. |
0.303 |
|
| 1989 |
White BE, Patt ME, Cotts EJ. Solid State Reactions in Mechanically Deformed Composites in the Ni-Zr and the Ni-Ti Systems Mrs Proceedings. 170. DOI: 10.1557/Proc-170-185 |
0.423 |
|
| 1988 |
Anlage SM, Johnson WL, Cotts EJ, Follstaedt DM, Knapp JA. Electrical transport properties of the aluminum-ruthenium icosahedral phase. Physical Review. B, Condensed Matter. 38: 7802-7805. PMID 9945511 DOI: 10.1103/Physrevb.38.7802 |
0.332 |
|
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