☰

John D. Lincoln, Ph.D.

Affiliations: 
2007 University of California, Irvine, Irvine, CA 
Area:
Materials Science Engineering, Environmental Engineering, Environmental Sciences
Google:
"John Lincoln"
Cross-listing: Envirotree

Tree Publications Similar researchers PubMed Report error

Parents

Sign in to add mentor
James Earthman grad student 2007 UC Irvine
 (New materials for electronic product design -for -the -environment: Balancing performance characteristics, renewable resources, and toxicity potential for printed wiring boards.)

Children

Sign in to add trainee

Collaborators

Sign in to add collaborator
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Lincoln JD, Shapiro AA, Earthman JC, et al. (2008) Design and evaluation of bioepoxy-flax composites for printed circuit boards Ieee Transactions On Electronics Packaging Manufacturing. 31: 211-220
Lincoln JD, Shapiro AA, Saphores JDM, et al. (2008) Moisture absorption phenomena in green composite printed circuit board prototypes Ieee International Symposium On Electronics and the Environment
Lincoln JD, Earthman JC, Ogunseitan OA, et al. (2007) Renewable-resource printed wiring board design using natural fibers and a bio-based thermosetting matrix Ieee International Symposium On Electronics and the Environment. 190-195
Lincoln JD, Rieger LE, Earthman JC. (2006) Instrumentation for determining the local damping capacity in honeycomb sandwich composites Journal of Testing and Evaluation. 34: 232-236
Lincoln JD, Ogunseitan OA, Saphores JDM, et al. (2005) Environmentally benign materials for electronics: A review of current developments and emerging technologies Proceedings of the International Symposium and Exhibition On Advanced Packaging Materials Processes, Properties and Interfaces. 2005: 139-143
Lincoln JD, Ogunseitan OA, Saphores JDM, et al. (2005) Environmentally benign materials for electronics; A review of current developments and emerging technologies Materials Science and Technology. 3: 49-56
See more...