Brad L. Boyce, Ph.D.
Affiliations: | 2001 | University of California, Berkeley, Berkeley, CA, United States |
Area:
Materials Science Engineering, Mechanical Engineering, Aerospace EngineeringGoogle:
"Brad Boyce"Parents
Sign in to add mentor| Robert O. Ritchie | grad student | 2001 | UC Berkeley | |
| (Understanding impact-induced fatigue failure.) | ||||
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Publications
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| Shang Z, Sun T, Ding J, et al. (2023) Gradient nanostructured steel with superior tensile plasticity. Science Advances. 9: eadd9780 |
| Gupta S, Stangebye S, Jungjohann K, et al. (2020) In situ TEM measurement of activation volume in ultrafine grained gold. Nanoscale |
| Zarnas P, Dingreville R, Muntifering B, et al. (2020) Statistical analysis of the interaction between irradiation-induced defects and triple junctions Advanced Modeling and Simulation in Engineering Sciences. 7: 1-20 |
| Rodriguez MA, Harrison KL, Goriparti S, et al. (2020) Use of a Be-dome holder for texture and strain characterization of Li metal thin films via sin2(ψ) methodology Powder Diffraction. 35: 89-97 |
| Heckman NM, Padilla HA, Michael JR, et al. (2020) Rethinking scaling laws in the high-cycle fatigue response of nanostructured and coarse-grained metals International Journal of Fatigue. 134: 105472 |
| Roach AM, White BC, Garland A, et al. (2020) Size-dependent stochastic tensile properties in additively manufactured 316L stainless steel Additive Manufacturing. 32: 101090 |
| Bahena JA, Heckman NM, Barr CM, et al. (2020) Development of a heterogeneous nanostructure through abnormal recrystallization of a nanotwinned Ni superalloy Acta Materialia. 195: 132-140 |
| Schuler JD, Grigorian CM, Barr CM, et al. (2020) Amorphous intergranular films mitigate radiation damage in nanocrystalline Cu-Zr Acta Materialia. 186: 341-354 |
| Noell PJ, Sabisch JEC, Medlin DL, et al. (2020) Nanoscale conditions for ductile void nucleation in copper: Vacancy condensation and the growth-limited microstructural state Acta Materialia. 184: 211-224 |
| Noell PJ, Sills RB, Boyce BL. (2020) Suppression of Void Nucleation in High-Purity Aluminum via Dynamic Recrystallization Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 51: 154-166 |