Chris Eberl
Affiliations: | Albert-Ludwigs-Universität Freiburg, Freiburg im Breisgau, Baden-Württemberg, Germany |
Google:
"Chris Eberl"
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Piotter V, Eberl C, Kraft O. (2017) Miniaturisation? Yes, please! German Research. 39: 26-29 |
| Slaby SA, Kraft O, Eberl C. (2016) Fatigue properties of conventionally manufactured and micro‐powder‐injection‐moulded 17‐4PH micro‐components Fatigue & Fracture of Engineering Materials & Structures. 39: 780-789 |
| Leisen D, Rusanov R, Rohlfing F, et al. (2015) Mechanical characterization between room temperature and 1000 °C of SiC free-standing thin films by a novel high-temperature micro-tensile setup. The Review of Scientific Instruments. 86: 055104 |
| Ulas S, Bundschuh S, Jester SS, et al. (2014) Mechanical properties of C58 materials and their dependence on thermal treatment Carbon. 68: 125-137 |
| Yoo BG, Boles ST, Liu Y, et al. (2014) Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading Acta Materialia. 81: 184-193 |
| Burger S, Rupp B, Ludwig A, et al. (2011) Fatigue testing of thin films Key Engineering Materials. 465: 552-555 |
| Burger S, Eberl C, Siegel A, et al. (2011) A novel high-throughput fatigue testing method for metallic thin films Science and Technology of Advanced Materials. 12 |
| Eberl C, Riesch-Oppermann H, Spolenak R, et al. (2010) In situ Observations and Quantitative Analysis of Short Circuit Probability Due to Ultrahigh Frequency Fatigue Ieee Transactions On Device and Materials Reliability. 10: 366-373 |
| Lohmiller J, Eberl C, Schwaiger R, et al. (2008) Mechanical spectroscopy of nanocrystalline nickel near room temperature Scripta Materialia. 59: 467-470 |
| Eberl C, Spolenak R, Kraft O, et al. (2007) Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach Thin Solid Films. 515: 3291-3297 |