Dietrich A. Dehlinger, Ph.D.
Affiliations: | 2008 | Electrical Engineering (Applied Physics) | University of California, San Diego, La Jolla, CA |
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BiomedicalGoogle:
"Dietrich Dehlinger"Parents
Sign in to add mentorSadik C. Esener | grad student | 2008 | UCSD | |
(Electric field directed self assembly of nanoparticle structures.) | ||||
Michael J. Heller | grad student | 2008 | UCSD | |
(Electric field directed self assembly of nanoparticle structures.) |
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Publications
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Ryu J, Dehlinger D, Heller M, et al. (2010) Electrophoretic layer-by-layer assembly of biotin/avidin functionalized nanoparticles Particle and Particle Systems Characterization. 26: 275-282 |
Krishnan R, Dehlinger DA, Gemmen GJ, et al. (2009) Interaction of Nanoparticles at the DEP Microelectrode Interface under High Conductance Conditions. Electrochemistry Communications. 11: 1661-1666 |
Dehlinger DA, Sullivan BD, Esener S, et al. (2008) Directed hybridization of DNA derivatized nanoparticles into higher order structures. Nano Letters. 8: 4053-60 |
Dehlinger DA, Sullivan BD, Esener S, et al. (2007) Electric-field-directed assembly of biomolecular-derivatized nanoparticles into higher-order structures. Small (Weinheim An Der Bergstrasse, Germany). 3: 1237-44 |
Sullivan BD, Dehlinger DA, Zlatanovic S, et al. (2007) Low-frequency electrophoretic actuation of nanoscale optoentropic transduction mechanisms. Nano Letters. 7: 950-5 |
Dehlinger D, Sullivan B, Esener S, et al. (2007) Automated Combinatorial Process for Nanofabrication of Structures Using Bioderivatized Nanoparticles Jala - Journal of the Association For Laboratory Automation. 12: 267-276 |
Dehlinger DA, Sullivan BD, Esener S, et al. (2006) Electric field assisted assembly of functionalized quantum dots into multiple layer thin films 2006 Nsti Nanotechnology Conference and Trade Show - Nsti Nanotech 2006 Technical Proceedings. 1: 389-392 |
Heller MJ, Dehlinger DA, Sullivan BD. (2006) Parallel assisted assembly of multilayer DNA and protein nanoparticle structures using a CMOS electronic array Aip Conference Proceedings. 859: 73-81 |