Year |
Citation |
Score |
2015 |
Balakrisnan B, Nacev A, Smela E. Design of bending multi-layer electroactive polymer actuators Smart Materials and Structures. 24. DOI: 10.1088/0964-1726/24/4/045032 |
0.564 |
|
2014 |
Gerratt AP, Balakrisnan B, Penskiy I, Bergbreiter S. Dielectric elastomer actuators fabricated using a micro-molding process Smart Materials and Structures. 23. DOI: 10.1088/0964-1726/23/5/055004 |
0.424 |
|
2012 |
Balakrisnan B, Nacev A, Burke JM, Dasgupta A, Smela E. Design of compliant meanders for applications in MEMS, actuators, and flexible electronics Smart Materials and Structures. 21. DOI: 10.1088/0964-1726/21/7/075033 |
0.541 |
|
2011 |
Alben S, Balakrisnan B, Smela E. Edge effects determine the direction of bilayer bending. Nano Letters. 11: 2280-5. PMID 21528897 DOI: 10.1021/Nl200473P |
0.514 |
|
2010 |
Balakrisnan B, Smela E. Challenges in the microfabrication of dielectric elastomer actuators Proceedings of Spie - the International Society For Optical Engineering. 7642. DOI: 10.1117/12.847613 |
0.546 |
|
2009 |
Balakrisnan B, Patil S, Smela E. Patterning PDMS using a combination of wet and dry etching Journal of Micromechanics and Microengineering. 19. DOI: 10.1088/0960-1317/19/4/047002 |
0.536 |
|
2007 |
Liew SL, Balakrisnan B, Ho CS, Thomas O, Chi DZ. Phase and texture of Er-germanide formed on Ge(001) through a solid-state reaction Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2372582 |
0.307 |
|
2006 |
Liew SL, Lee RTP, Lee KY, Balakrisnan B, Chow SY, Lai MY, Chi DZ. Enhanced morphological stability of NiGe films formed using Ni(Zr) alloy Thin Solid Films. 504: 104-107. DOI: 10.1016/J.Tsf.2005.09.149 |
0.354 |
|
2006 |
Liew SL, Balakrisnan B, Chow SY, Lai MY, Wang WD, Lee KY, Ho CS, Osipowicz T, Chi DZ. Growth of high quality Er-Ge films on Ge(001) substrates by suppressing oxygen contamination during germanidation annealing Thin Solid Films. 504: 81-85. DOI: 10.1016/J.Tsf.2005.09.046 |
0.323 |
|
2006 |
Chen Z, He M, Balakrisnan B, Chum CC. Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films Materials Science and Engineering A. 423: 107-110. DOI: 10.1016/J.Msea.2005.12.038 |
0.343 |
|
2003 |
Balakrisnan B, Chum CC, Li M, Chen Z, Cahyadi T. Fracture toughness of Cu-Sn intermetallic thin films Journal of Electronic Materials. 32: 166-171. DOI: 10.1007/S11664-003-0188-X |
0.31 |
|
2002 |
Balakrisnan B, Tomcik B, Blackwooda DJ. Influence of carbon sputtering conditions on corrosion protection of magnetic layer by an electrochemical technique Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1448819 |
0.353 |
|
2002 |
Tomcik B, Seng SC, Balakrisnan B, Lee JY. Electrochemical tests on the carbon protective layer of a hard disk Diamond and Related Materials. 11: 1409-1415. DOI: 10.1016/S0925-9635(02)00038-9 |
0.323 |
|
2002 |
Zhang F, Li M, Balakrisnan B, Chen WT. Failure mechanism of lead-free solder joints in flip chip packages Journal of Electronic Materials. 31: 1256-1263. DOI: 10.1007/S11664-002-0018-6 |
0.335 |
|
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