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Alan Lee, Ph.D.

Affiliations: 
2005 Stanford University, Palo Alto, CA 
Area:
materials science
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"Alan Lee"
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Cross-listing: Materials Tree

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William D. Nix grad student 2005 Stanford
 (Stress induced delamination methods for the study of platinum adhesion.)

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Lee A, Litteken CS, Dauskardt RH, et al. (2005) Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method Acta Materialia. 53: 609-616
Lee A, Clemens BM, Nix WD. (2004) Stress induced delamination methods for the study of adhesion of Pt thin films to Si Acta Materialia. 52: 2081-2093
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