Jesmin Haq, Ph.D.
Affiliations: | 2011 | Chemical Engineering | Arizona State University, Tempe, AZ, United States |
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Parents
Sign in to add mentor| Bryan D. Vogt | grad student | 2011 | Arizona State | |
| (Thermo-mechanical analysis of temporary bonding systems for flexible microelectronics fabrication applications.) | ||||
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| Thomas L, Jan G, Zhu J, et al. (2014) Perpendicular spin transfer torque magnetic random access memories with high spin torque efficiency and thermal stability for embedded applications (invited) Journal of Applied Physics. 115 |
| Haq J, Vogt BD, Raupp GB, et al. (2012) Finite element modeling of temporary bonding systems for flexible microelectronics fabrication Microelectronic Engineering. 94: 18-25 |
| Haq J, Vogt BD, Raupp GB, et al. (2011) Impact of adhesive rheology on stress-distortion of bonded plastic substrates for flexible electronics applications Microelectronic Engineering. 88: 2852-2856 |
| Haq J, Vogt BD, Howard E, et al. (2010) Temporary bond-debond technology for high-performance transistors on flexible substrates Journal of the Society For Information Display. 18: 884-891 |
| Haq J, Ageno S, Raupp GB, et al. (2010) Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance Journal of Applied Physics. 108 |
| O'Rourke SM, Loy DE, Moyer C, et al. (2008) Direct fabrication of a-Si:H thin film transistor arrays on flexible substrates: Critical challenges and enabling solutions Ecs Transactions. 16: 49-54 |
| O'Rourke SM, Loy DE, Moyer C, et al. (2008) Direct fabrication of a-Si:H thin film transistor arrays on flexible substrates for low power flexible displays Sid Conference Record of the International Display Research Conference. 122-125 |