J. Jay McMahon, Ph.D.
Affiliations: | 2008 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Electronics and Electrical Engineering, Materials Science EngineeringGoogle:
"J. McMahon"Mean distance: (not calculated yet)
Parents
Sign in to add mentor| Ronald J. Gutmann | grad student | 2008 | RPI | |
| (Damascene patterned metal/adhesive wafer bonding for three-dimensional integration.) | ||||
| James Jian-Qiang Lu | grad student | 2008 | RPI (Physics Tree) | |
| (Damascene patterned metal/adhesive wafer bonding for three-dimensional integration.) | ||||
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Publications
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| Klionsky DJ, Abdelmohsen K, Abe A, et al. (2016) Guidelines for the use and interpretation of assays for monitoring autophagy (3rd edition). Autophagy. 12: 1-222 |
| Lu J, McMahon JJ, Gutmann RJ. (2008) 3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces Mrs Proceedings. 1112 |
| Gutmann RJ, McMahon JJ, Lu J. (2006) Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers Mrs Proceedings. 970 |
| Lee SH, Niklaus F, McMahon JJ, et al. (2006) Fine keyed alignment and bonding for wafer-level 3D ICs Materials Research Society Symposium Proceedings. 914: 433-438 |
| Yu J, Moore RL, Lee SH, et al. (2006) Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate Mrs Proceedings. 914 |
| Niklaus F, Kumar RJ, McMahon JJ, et al. (2006) Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration Journal of the Electrochemical Society. 153 |
| Yu J, McMahon JJ, Lu J-, et al. (2004) 200. mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions Mrs Proceedings. 843 |
| Kwon Y, Yu J, McMahon JJ, et al. (2004) Evaluation of thin dielectric-glue wafer-bonding for three dimensional integrated circuit-applications Materials Research Society Symposium Proceedings. 812: 321-326 |
| McMahon JJ, Kwon Y, Lu JQ, et al. (2003) Bonding characterization of oxidized PDMS thin films Materials Research Society Symposium - Proceedings. 795: 99-104 |