Sumeet Mishra
Affiliations: | IIT-Kanpur |
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Mishra S, Kumar M, Singh A. (2020) Evolution of rotated Brass texture by cross rolling: implications on formability Materials Science and Technology. 36: 1272-1281 |
Roy A, Tiwari M, Sahu S, et al. (2020) Microstructure, Texture and Mechanical Properties of Al-Mg-Si Alloy Processed by Multiaxial Compression Journal of Materials Engineering and Performance. 29: 3876-3888 |
Mishra S, Beura VK, Singh A, et al. (2019) Effect of obstacle strength and spacing on the slope of Haasen plot Materials Science and Technology. 35: 403-408 |
Nayan N, Mishra S, Prakash A, et al. (2019) Origin of through-thickness serrated tensile flow behavior in Al–Cu–Li (AA2195) alloy: Effect of microstructure and texture Materialia. 5: 100180 |
Nayan N, Mishra S, Prakash A, et al. (2019) Effect of cross-rolling on microstructure and texture evolution and tensile behavior of aluminium-copper-lithium (AA2195) alloy Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 252-261 |
Mishra S, Singh A, Beura VK, et al. (2019) Uncharacteristic evolution of copper type texture in the presence of shearable precipitates Materials Chemistry and Physics. 229: 61-65 |
Mishra S, Yadava M, Kulkarni KN, et al. (2019) A new phenomenological approach for modeling strain hardening behavior of face centered cubic materials Acta Materialia. 178: 99-113 |
Mishra S, Beura VK, Singh A, et al. (2019) A Perspective on Strain Hardening Behavior of Materials Considering Mobile Dislocation Density and Activation Volume Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 50: 3472-3477 |
Mishra S, Yadava M, Kulkarni KN, et al. (2018) A theoretical investigation of the effect of precipitate habit plane on plastic anisotropy in age hardenable aluminium alloys Modelling and Simulation in Materials Science and Engineering. 26: 55011 |
Mishra S, Beura VK, Singh A, et al. (2018) Deformation behaviour of Al–Cu–Li alloy containing T1 precipitates Materials Science and Technology. 34: 2105-2113 |