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Suresh Sitaraman

Affiliations: 
Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Computer Science
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"Suresh Sitaraman"
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Parents

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Children

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Rajiv C. Dunne grad student 2000 Georgia Tech
Weidong Xie grad student 2001 Georgia Tech
Lunyu Ma grad student 2003 Georgia Tech
Mitul B. Modi grad student 2003 Georgia Tech
Sai Zeng grad student 2004 Georgia Tech
Sakethraman Mahalingam grad student 2005 Georgia Tech
Injoong Kim grad student 2007 Georgia Tech
Andrew E. Perkins grad student 2007 Georgia Tech
Shashikant G. Hegde grad student 2008 Georgia Tech
Karan Kacker grad student 2008 Georgia Tech
Krishna R. Tunga grad student 2008 Georgia Tech
Jiantao Zheng grad student 2008 Georgia Tech

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Publications

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Green C, Kottke P, Han X, et al. (2015) A review of two-phase forced cooling in three-dimensional stacked electronics: Technology integration Journal of Electronic Packaging, Transactions of the Asme. 137
Raghavan S, Schmadlak I, Leal G, et al. (2013) Chip-package co-design: Effect of substrate warpage on BEOL reliability Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10
Okereke R, Sitaraman SK. (2013) Three-path electroplated copper compliant interconnects - Fabrication and modeling studies Proceedings - Electronic Components and Technology Conference. 129-135
Liu X, Chen Q, Sundaram V, et al. (2013) Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test Microelectronics Reliability. 53: 70-78
Okereke R, Kacker K, Sitaraman SK. (2010) Parallel-path compliant structures as electrical interconnects Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 479-486
Liu X, Zheng J, Sitaraman SK. (2010) Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly Journal of Electronic Packaging. 132
Zheng J, Ostrowicki G, Sitaraman SK. (2010) Cyclic Magnetic Actuation for Potential Characterization of Interfacial Fatigue Fracture Ieee Transactions On Components and Packaging Technologies. 33: 648-654
Tunga K, Sitaraman SK. (2010) Laser moiré interferometry for fatigue life prediction of lead-free solders Microelectronics Reliability. 50: 2026-2036
Kim I, Peak RS, Sitaraman SK. (2010) ROM: A reliability knowledge representation for collaborative system design Engineering With Computers. 26: 11-33
Kacker K, Sitaraman SK. (2009) Reliability assessment and failure analysis of G-Helix, a free-standing compliant off-chip interconnect Journal of Microelectronics and Electronic Packaging. 6: 59-65
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