Erdem Matoglu, Ph.D.
Affiliations: | 2004 | Georgia Institute of Technology, Atlanta, GA |
Area:
Electronics and Electrical EngineeringGoogle:
"Erdem Matoglu"Parents
Sign in to add mentor| Madhavan Swaminathan | grad student | 2004 | Georgia Tech | |
| (Statistical design, analysis, and diagnosis of digital systems and embedded RF circuits.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Pham N, Kim TH, Matoglu E, et al. (2009) Voltage regulator device and power distribution network optimization Designcon 2009. 2: 1042-1056 |
| Pham N, Mutnury B, Cases M, et al. (2008) Efficient modeling and design optimization methodology for integrated power and signal distribution in digital systems International Engineering Consortium - Designcon 2008. 1563-1576 |
| Pham N, Mutnury B, Matoglu E, et al. (2007) Package model for efficient simulation, design, and characterization of high performance electronic systems Proceedings - 10th Ieee Workshop On Signal Propagation On Interconnects, Spi 2006. 39-42 |
| Singh N, Mutnury B, Wesley C, et al. (2007) Swarm intelligence for electrical design space exploration Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 21-24 |
| Wesley C, Mutnury B, Pham N, et al. (2007) Electrical design space exploration for high speed servers Proceedings - Electronic Components and Technology Conference. 1748-1753 |
| Mutnury B, Swaminthan M, Cases M, et al. (2006) Macromodeling of nonlinear transistor-level receiver circuits Ieee Transactions On Advanced Packaging. 29: 55-66 |
| Mutnury B, Cases M, Pham N, et al. (2006) Genetic algorithms with scalable I/O macromodels to find the worst case corner in high-speed server electrical analysis Electrical Performance of Electronic Packaging, Epep. 73-76 |
| Muthana P, Matoglu E, Pham N, et al. (2006) Analysis of embedded package capacitors for high performance components Electrical Performance of Electronic Packaging, Epep. 55-58 |
| Pham N, Cases M, De Araujo DN, et al. (2006) Embedded capacitor in power distribution design of high-end server packages Proceedings - Electronic Components and Technology Conference. 2006: 1677-1682 |
| Ege Engin A, Bharath K, Swaminathan M, et al. (2006) Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards Proceedings - Electronic Components and Technology Conference. 2006: 1262-1267 |