Yin-Jung Chang, Ph.D.
Affiliations: | 2006 | Georgia Institute of Technology, Atlanta, GA |
Area:
Electronics and Electrical Engineering, Optics PhysicsGoogle:
"Yin-Jung Chang"Parents
Sign in to add mentor| Gee-Kung Chang | grad student | 2006 | Georgia Tech | |
| (Optical interconnects for in -plane high -speed signal distribution at 10 Gb/s: Analysis and demonstration.) | ||||
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Publications
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| Chang Y, Liu Y. (2011) A Plasmonic-Mode-Assisted Sharp Waveguide Bend for Silicon Optical Nanocircuitry Ieee Photonics Technology Letters. 23: 121-123 |
| Chang Y, Guidotti D, Chang G. (2008) An Anchor-Board-Based Flexible Optoelectronic Harness for Off-Chip Optical Interconnects Ieee Photonics Technology Letters. 20: 839-841 |
| Chang YJ, Gaylord TK, Chang GK. (2007) Attenuation in waveguides on FR-4 boards due to periodic substrate undulations. Applied Optics. 46: 2234-43 |
| Huang ZR, Guidotti D, Wan L, et al. (2007) Hybrid integration of end-to-end optical interconnects on printed circuit boards Ieee Transactions On Components and Packaging Technologies. 30: 708-715 |
| Chang Y. (2007) Recent progress of EDC commercialization in addressing datacom and telecom challenges to enable high-speed optical enterprise, metro and long-haul networks Ofc/Nfoec 2007 - Optical Fiber Communication and the National Fiber Optic Engineers Conference 2007 |
| Doany FE, Schow CL, Baks C, et al. (2007) 160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC Proceedings - Electronic Components and Technology Conference. 1256-1261 |
| Chang Y. (2007) Recent progress of EDC commercialization in addressing datacom and telecom challenges to enable high-speed optical enterprise, metro and long-haul networks Optics Infobase Conference Papers |
| Chang Y, Guidotti D, Wan L, et al. (2006) Board-level optical-to-electrical signal distribution at 10 gb/s Ieee Photonics Technology Letters. 18: 1828-1830 |
| Chang GK, Guidotti D, Huang ZR, et al. (2005) High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems Proceedings of Spie - the International Society For Optical Engineering. 5814: 176-190 |
| Chang G, Guidotti D, Liu F, et al. (2004) Chip-to-chip optoelectronics SOP on organic boards or packages Ieee Transactions On Advanced Packaging. 27: 386-397 |