Woojin Choi, Ph.D.
Affiliations: | 2002 | University of California, Los Angeles, Los Angeles, CA |
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder jointsGoogle:
"Woojin Choi"Parents
Sign in to add mentor| King-ning Tu | grad student | 2002 | UCLA | |
| (Reliability of lead-free solders in electronic packaging technology.) | ||||