Joseph Mundy, Ph.D.
Affiliations: | Electrical Engineering | Brown University, Providence, RI |
Area:
Computer vision, artificial intelligence, multimediaGoogle:
"Joseph Mundy"
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Publications
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| Restrepo MI, Ulusoy AO, Mundy JL. (2014) Evaluation of feature-based 3-d registration of probabilistic volumetric scenes Isprs Journal of Photogrammetry and Remote Sensing. 98: 1-18 |
| Ulusoy AO, Mundy JL. (2014) Image-based 4-d reconstruction using 3-d change detection Lecture Notes in Computer Science (Including Subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 8691: 31-45 |
| Ozcanli O, Crispell D, Mundy J, et al. (2012) 3D modeling using miniscule volume elements Spie Newsroom |
| Crispell D, Mundy J, Taubin G. (2012) A variable-resolution probabilistic three-dimensional model for change detection Ieee Transactions On Geoscience and Remote Sensing. 50: 489-500 |
| Restrepo MI, Mayer BA, Ulusoy AO, et al. (2012) Characterization of 3-D volumetric probabilistic scenes for object recognition Ieee Journal On Selected Topics in Signal Processing. 6: 522-537 |
| Restrepo MI, Mayer BA, Mundy JL. (2012) Object recognition in probabilistic 3-d volumetric scenes Icpram 2012 - Proceedings of the 1st International Conference On Pattern Recognition Applications and Methods. 2: 180-190 |
| Jannaty P, Sabou FC, Bahar RI, et al. (2011) Full two-dimensional markov chain analysis of thermal soft errors in subthreshold nanoscale CMOS devices Ieee Transactions On Device and Materials Reliability. 11: 50-59 |
| Leotta MJ, Mundy JL. (2010) Vehicle Surveillance with a Generic, Adaptive, 3-D Vehicle Model. Ieee Transactions On Pattern Analysis and Machine Intelligence |
| Mundy JL, Ozcanli OC. (2009) Uncertain geometry: A new approach to modeling for recognition Proceedings of Spie - the International Society For Optical Engineering. 7335 |
| Sabou FC, Kazazis D, Bahar RI, et al. (2009) Markov chain analysis of thermally induced soft errors in subthreshold nanoscale CMOS circuits Ieee Transactions On Device and Materials Reliability. 9: 494-504 |