Yuki Fukuda, Ph.D.
Affiliations: | 2005 | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringGoogle:
"Yuki Fukuda"Parents
Sign in to add mentorMichael G. Pecht | grad student | 2005 | University of Maryland | |
(Experimental investigations of whisker formation on tin platings.) |
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Publications
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Fukuda Y, Osterman M, Pecht M. (2007) Length Distribution Analysis for Tin Whisker Growth Ieee Transactions On Electronics Packaging Manufacturing. 30: 36-40 |
Fukuda Y, Osterman MD, Pecht MG. (2007) The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth Microelectronics Reliability. 47: 88-92 |
Fukuda Y, Osterman M, Pecht M. (2006) The Effect of Annealing on Tin Whisker Growth Ieee Transactions On Electronics Packaging Manufacturing. 29: 252-258 |
Eveloy V, Ganesan S, Fukuda Y, et al. (2005) Are you ready for lead-free electronics? Ieee Transactions On Components and Packaging Technologies. 28: 884-894 |
Pecht M, Fukuda Y, Rajagopal S. (2004) The impact of lead-free legislation exemptions on the electronics industry Ieee Transactions On Electronics Packaging Manufacturing. 27: 221-232 |
Fukuda Y, Casey P, Pecht M. (2003) Evaluation of selected japanese lead-free consumer electronics [Abstracts of Forthcoming Manuscripts] Ieee Transactions On Electronics Packaging Manufacturing. 26: 265-265 |
Fukuda Y, Casey P, Pecht M. (2003) Evaluation of selected Japanese lead-free consumer electronics Ieee Transactions On Electronics Packaging Manufacturing. 26: 305-312 |