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Dereje Agonafer

Affiliations: 
Mechanical Engineering University of Texas at Arlington, Arlington, TX, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering
Website:
https://www.uta.edu/academics/faculty/profile?username=agonafer
Google:
"Dereje Agonafer"
Bio:

DOI: 10.1016/0021-9290(85)90024-7

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Parents

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Joseph Nevel Cannon grad student 1984 Howard University
Charles B. Watkins grad student 1984 Howard University

Children

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Wonkee Ahn grad student 2004 UT Arlington
Abhijit D. Kaisare grad student 2007 UT Arlington
Veerendra P. Mulay grad student 2009 UT Arlington
Saket Karajgikar grad student 2010 UT Arlington
Nikhil R. Lakhkar grad student 2010 UT Arlington
Huy N. Phan grad student 2011 UT Arlington
Saeed Ghalambor grad student 2014 UT Arlington

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Publications

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Kasukurthy R, Rachakonda A, Agonafer D. (2021) Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling Journal of Electronic Packaging. 143
Misrak A, Chauhan T, Rajmane P, et al. (2020) Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers Journal of Electronic Packaging. 142
Bansode PV, Shah JM, Gupta G, et al. (2020) Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time Journal of Electronic Packaging. 142
Shah JM, Eiland R, Rajmane P, et al. (2019) Reliability Considerations for Oil Immersion-Cooled Data Centers Journal of Electronic Packaging. 141: 21007
Misrak A, Nguyen L, Kummerl S, et al. (2018) Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation Journal of Microelectronics and Electronic Packaging. 15: 95-100
Sahini M, Agonafer D. (2018) Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis Journal of Microelectronics and Electronic Packaging. 15: 21-34
Eiland R, Fernandes JE, Nagendran B, et al. (2017) Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation Journal of Electronic Packaging. 139: 41011
Fernandes JE, Eiland R, Nagendran B, et al. (2017) Effectiveness of Rack-Level Fans: Part II - Control Strategies and System Redundancy Journal of Electronic Packaging. 139: 41012
Eiland R, Fernandes JE, Vallejo M, et al. (2017) Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions Journal of Electronic Packaging. 139: 41005
Lee H, Agonafer DD, Won Y, et al. (2016) Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138
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