Dhruv Bhate, Ph.D.
Affiliations: | 2008 | Mechanical Engineering | Purdue University, West Lafayette, IN, United States |
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"Dhruv Bhate"Parents
Sign in to add mentorGanesh Subbarayan | grad student | 2008 | Purdue | |
(Hierarchy in fracture as a stochastic process: Model, implementation and validation.) |
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Publications
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Lam Q, Patil D, Le T, et al. (2019) An Examination of the Low Strain Rate Sensitivity of Additively Manufactured Polymer, Composite and Metallic Honeycomb Structures. Materials (Basel, Switzerland). 12 |
Chan D, Nie X, Bhate D, et al. (2013) Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 133-146 |
Bhate D, Mysore K, Subbarayan G. (2012) An information theoretic argument on the form of damage accumulation in solids Mechanics of Advanced Materials and Structures. 19: 184-195 |
Chan D, Nie X, Bhate D, et al. (2010) High strain rate behavior of Sn3.8Ag0.7Cu solder alloys and its influence on the fracture location within solder joints Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 989-995 |
Chan D, Bhate D, Subbarayan G, et al. (2010) Predicting crack growth and fatigue lives of QFN solder joints using a multiscale fracture model Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 207-213 |
Chan D, Bhate D, Subbarayan G, et al. (2010) Characterization of crack fronts in a WLCSP package: Experiments and models for application of a multiscale fracture theory Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 199-205 |
Bhate D, Mysore K, Subbarayan G. (2010) A multiscale damage accumulation theory for solder joint failure Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 191-197 |
Bhate D, Chan D, Subbarayan G, et al. (2010) Singularities at Solder Joint Interfaces and Their Effects on Fracture Models Journal of Electronic Packaging. 132: 21007 |
Bhate D, Subbarayan G, Zhao J, et al. (2009) Improved solder joint fatigue models through reduced geometry dependence of empirical fits Journal of Electronic Packaging, Transactions of the Asme. 131: 0445021-0445023 |
Bhate D, Chan D, Subbarayan G, et al. (2008) Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 183-196 |