Hua Ye, Ph.D.
Affiliations: | 2004 | State University of New York, Buffalo, Buffalo, NY, United States |
Area:
Civil Engineering, Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Hua Ye"Parents
Sign in to add mentor| Cemal Basaran | grad student | 2004 | SUNY Buffalo | |
| (Mechanical behavior of microelectronics and power electronics solder joints under high current density: Analytical modeling and experimental investigation.) | ||||
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Publications
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| Ye H, Basaran C, Hopkins DC. (2006) Experimental damage mechanics of micro/power electronics solder joints under electric current stresses International Journal of Damage Mechanics. 15: 41-67 |
| Basaran C, Lin M, Ye H. (2004) A thermodynamic model for electrical current induced damage Proceedings - Electronic Components and Technology Conference. 2: 1738-1745 |
| Ye H, Basaran C, Hopkins DC. (2003) Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines Ieee Transactions On Components and Packaging Technologies. 26: 673-681 |
| Ye H, Basaran C, Hopkins D. (2003) Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing Applied Physics Letters. 82: 1045-1047 |
| Ye H, Hopkins DC, Basaran C. (2003) Measurement of high electrical current density effects in solder joints Microelectronics Reliability. 43: 2021-2029 |
| Ye H, Lin M, Basaran C. (2001) Failure modes and FEM analysis of power electronic packaging Advances in Electronic Packaging. 1: 417-428 |