Bei Peng, Ph.D.

Affiliations: 
2008 Mechanical Engineering Northwestern University, Evanston, IL 
Area:
Mechanical Engineering, Materials Science Engineering
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"Bei Peng"

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Horacio D. Espinosa grad student 2008 Northwestern
 (Mechanical characterization of one-dimensional nanomaterials.)
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Publications

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Hao R, Yu H, Peng B, et al. (2020) Impacts of Residual Stress on Micro Vibratory Platform Used for Inertial Sensor Calibration. Sensors (Basel, Switzerland). 20
Zeng Z, Deng X, Cui J, et al. (2019) Improvement on Selective Laser Sintering and Post-Processing of Polystyrene. Polymers. 11
Weng X, Kang Y, Guo Q, et al. (2019) Recent advances in thread-based microfluidics for diagnostic applications. Biosensors & Bioelectronics. 132: 171-185
Jiang H, Yang X, Fan N, et al. (2018) Numerical and experimental investigation of 'water fan' effect due to electrohydrodynamic force in a microchamber. Electrophoresis
Zhou W, He J, Yu H, et al. (2018) Glass Polarization Induced Drift of a Closed-Loop Micro-Accelerometer. Materials (Basel, Switzerland). 11
Zeng Z, Zhou Z, Li X, et al. (2018) Numerical modeling and optimization on micro-D electrical connector International Journal of Numerical Modelling-Electronic Networks Devices and Fields. 31
Zhou W, Peng P, Yu H, et al. (2017) Material Viscoelasticity-Induced Drift of Micro-Accelerometers. Materials (Basel, Switzerland). 10
Zhou W, Li F, Yu H, et al. (2017) Influence of adhesive non-uniformity on zero offset of micro accelerometer International Journal of Modern Physics B. 31: 1750242
Peng P, Zhou W, Yu H, et al. (2017) A study of partial layout of adhesive on the thermal drift of MEMS capacitive accelerometers International Journal of Modern Physics B. 31: 1741006
Peng P, Zhou W, Yu H, et al. (2016) Investigation of the Thermal Drift of MEMS Capacitive Accelerometers Induced by the Overflow of Die Attachment Adhesive Ieee Transactions On Components, Packaging and Manufacturing Technology
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