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Vikram Venkatadri, Ph.D.

Affiliations: 
2012 Industrial Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Industrial Engineering, System Science Engineering, Mechanical Engineering
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"Vikram Venkatadri"
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Parents

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Daryl L. Santos grad student 2012 SUNY Binghamton
 (Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).)

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Publications

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Tumne P, Venkatadri V, Kudtarkar S, et al. (2012) Effect of design parameters on drop test performance of wafer level chip scale packages Journal of Electronic Packaging, Transactions of the Asme. 134
Tumne P, Venkatadri V, Kudtarkar S, et al. (2011) Effect of design parameters on drop test performance of wafer level chip scale packages (WLCSP) Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 713-721
Venkatadri V, Sammakia B, Srihari K, et al. (2011) A review of recent advances in thermal management in three dimensional chip stacks in electronic systems Journal of Electronic Packaging, Transactions of the Asme. 133
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