Jianfeng Luo, Ph.D.

Affiliations: 
2003 University of California, Berkeley, Berkeley, CA, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering, Materials Science Engineering
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David A Dornfeld grad student 2003 UC Berkeley
 (Integrated modeling of chemical mechanical planarization /polishing (CMP) for integrated circuit fabrication: From particle scale to die and wafer scales.)