Zahyun Ku, Ph.D.

Affiliations: 
2010 Electrical Engineering University of New Mexico, Albuquerque, NM, United States 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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"Zahyun Ku"

Parents

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Steven R. J. Brueck grad student 2010 Univ. of New Mexico
 (All-optical metamaterial modulators: Fabrication, simulation and characterization.)
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Publications

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Hwang J, Ku Z, Jeon J, et al. (2020) Polarization-Sensitive and Wide Incidence Angle-Insensitive Fabry-Perot Optical Cavity Bounded by Two Metal Grating Layers. Sensors (Basel, Switzerland). 20
Park JE, Jeon J, Park SJ, et al. (2020) Enhancement of Magneto-Mechanical Actuation of Micropillar Arrays by Anisotropic Stress Distribution. Small (Weinheim An Der Bergstrasse, Germany). e2003179
Jeon J, Park JE, Park SJ, et al. (2020) Shape-Programmed Fabrication and Actuation of Magnetically Active Micropost Arrays. Acs Applied Materials & Interfaces
Jeon J, Hwang J, Bhattarai K, et al. (2019) Robust metamaterial-based antireflection coating for surface plasmon polariton resonance Optical Materials Express. 9: 1290
Berndt AJ, Hwang J, Islam MD, et al. (2019) Poly(sulfur-random-(1,3-diisopropenylbenzene)) based mid-wavelength infrared polarizer: Optical property experimental and theoretical analysis Polymer. 176: 118-126
Hwang J, Oh B, Kim Y, et al. (2018) Fabry-Perot cavity resonance enabling highly polarization-sensitive double-layer gold grating. Scientific Reports. 8: 14787
Choi SH, Kim SW, Ku Z, et al. (2018) Anderson light localization in biological nanostructures of native silk. Nature Communications. 9: 452
Bhattarai K, Silva S, Song K, et al. (2017) Metamaterial Perfect Absorber Analyzed by a Meta-cavity Model Consisting of Multilayer Metasurfaces. Scientific Reports. 7: 10569
Jeon J, Bhattarai K, Kim DK, et al. (2016) A Low-loss Metasurface Antireflection Coating on Dispersive Surface Plasmon Structure. Scientific Reports. 6: 36190
Hwang J, Jeon J, Yoon S, et al. (2015) Surface plasmon resonant splitting and merging due to infrared incidence through thermal imaging lens Electronics Letters. 51: 1170-1172
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