Ming Kong, Ph.D.
Affiliations: | 2012 | Mechanical Engineering | University of Colorado, Boulder, Boulder, CO, United States |
Area:
Mechanical EngineeringGoogle:
"Ming Kong"Parents
Sign in to add mentor| Y.C Lee | grad student | 2012 | CU Boulder | |
| (Experimental and modeling studies on solder self-alignment for optoelectronic packaging.) | ||||