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Yung-Cheng Lee

Affiliations: 
Mechanical Engineering University of Colorado, Boulder, Boulder, CO, United States 
Area:
Mechanical Engineering, Materials Science Engineering, Packaging Engineering
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"Yung-Cheng Lee"
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Children

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Bingzhi Su grad student 2000 CU Boulder
Kevin F. Harsh grad student 2001 CU Boulder
Jianglong Zhang grad student 2002 CU Boulder
Zhichun Ma grad student 2003 CU Boulder
Faheem F. Faheem grad student 2004 CU Boulder

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Publications

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Wen R, Xu S, Zhao D, et al. (2018) Sustaining enhanced condensation on hierarchical mesh-covered surfaces National Science Review. 5: 878-887
Wen R, Xu S, Lee Y, et al. (2018) Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures Nano Energy. 51: 373-382
Wen R, Ma X, Lee Y, et al. (2018) Liquid-Vapor Phase-Change Heat Transfer on Functionalized Nanowired Surfaces and Beyond Joule. 2: 2307-2347
Wen R, Xu S, Ma X, et al. (2018) Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer Joule. 2: 269-279
Wen R, Xu S, Zhao D, et al. (2017) Hierarchical Superhydrophobic Surfaces with Micropatterned Nanowire Arrays for High-Efficiency Jumping Droplet Condensation. Acs Applied Materials & Interfaces
Wen R, Li Q, Wang W, et al. (2017) Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays Nano Energy. 38: 59-65
Yersak AS, Lewis RJ, Liew LA, et al. (2016) Atomic Layer Deposited Coatings on Nanowires for High Temperature Water Corrosion Protection. Acs Applied Materials & Interfaces. 8: 32616-32623
Yersak AS, Lee Y. (2016) Probabilistic distributions of pinhole defects in atomic layer deposited films on polymeric substrates Journal of Vacuum Science and Technology. 34
Xu S, Lewis RJ, Liew L, et al. (2016) Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure Journal of Microelectromechanical Systems. 25: 842-844
Lewis R, Xu S, Liew LA, et al. (2015) Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization Journal of Microelectromechanical Systems
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