Taiho Yeom, Ph.D.
Affiliations: | 2012 | Mechanical Engineering | University of Minnesota, Twin Cities, Minneapolis, MN |
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"Taiho Yeom"Parents
Sign in to add mentor| Tianhong Cui | grad student | 2012 | UMN | |
| (A Piezoelectric Translational Flow Agitator for Active Air Cooling of Electronics.) | ||||
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Publications
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| Yeom T, Huang L, Zhang M, et al. (2019) Heat transfer enhancement of air-cooled heat sink channel using a piezoelectric synthetic jet array International Journal of Heat and Mass Transfer. 143: 118484 |
| Yeom T, Simon T, Zhang M, et al. (2018) Active heat sink with piezoelectric translational agitators, piezoelectric synthetic jets, and micro pin fin arrays Experimental Thermal and Fluid Science. 99: 190-199 |
| Yeom T, Simon TW, North M, et al. (2016) High-frequency translational agitation with micro pin-fin surfaces for enhancing heat transfer of forced convection International Journal of Heat and Mass Transfer. 94: 354-365 |
| Yeom T, Simon T, Zhang T, et al. (2016) Enhanced heat transfer of heat sink channels with micro pin fin roughened walls International Journal of Heat and Mass Transfer. 92: 617-627 |
| Agrawal S, Yeom T, Yu Y, et al. (2014) The effects of agitator blade geometry and configuration for augmenting heat transfer by agitation in channel flows Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 8 |
| Yu Y, Simon TW, Zhang M, et al. (2014) Enhancing heat transfer in air-cooled heat sinks using piezoelectrically- driven agitators and synthetic jets International Journal of Heat and Mass Transfer. 68: 184-193 |
| Ayaskanta A, Huang L, Simon T, et al. (2013) Heat transfer enhancement of a heat sink by inclined synthetic jets for electronics cooling Asme 2013 Heat Transfer Summer Conf. Collocated With the Asme 2013 7th Int. Conf. On Energy Sustainability and the Asme 2013 11th Int. Conf. On Fuel Cell Science, Engineering and Technology, Ht 2013. 3 |
| Huang L, Simon T, Zhang M, et al. (2012) Noise measurements and reduction for high-frequency vibrating devices in the application of cooling electronics Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 7: 1497-1504 |
| Huang L, Agrawal S, Simon T, et al. (2012) Fluid damping and power consumption of active devices used in cooling electronics Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 7: 1489-1495 |
| Yeom T, Simon TW, Zhang T, et al. (2012) Convective heat transfer enhancement with micro pin-fin surfaces cooled by a piezoelectrically-driven translational agitator Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 7: 685-691 |