Kevin F. Harsh, Ph.D.

Affiliations: 
2001 University of Colorado, Boulder, Boulder, CO, United States 
Area:
Mechanical Engineering
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"Kevin Harsh"

Parents

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Yung-Cheng Lee grad student 2001 CU Boulder
 (Design optimization of MEMS solder self -assembly.)
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Publications

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Lee YC, McCarthy B, Diao J, et al. (2003) Computer-aided design for microelectromechanical systems (MEMS) International Journal of Materials & Product Technology. 18: 356
Lee YC, McCarthy B, Diao J, et al. (2003) Computer-aided design for microelectromechanical systems (MEMS) International Journal of Materials and Product Technology. 18: 356-380
Harsh KF, Bright VM, Lee YC. (2001) Design optimization of surface micro-machined self-assembled MEMS structures Advances in Electronic Packaging. 1: 155-161
Harsh KF, Su B, Zhang W, et al. (2000) Realization and design considerations of a flip-chip integrated MEMS tunable capacitor Sensors and Actuators, a: Physical. 80: 108-118
Harsh KF, Bright VM, Lee YC. (2000) Study of micro-scale limits of solder self-assembly for MEMS Proceedings - Electronic Components and Technology Conference. 1690-1695
Harsh KF, Bright VM, Lee YC. (1999) Solder self-assembly for three-dimensional microelectromechanical systems Sensors and Actuators, a: Physical. 77: 237-244
Kladitis PE, Bright VM, Harsh KF, et al. (1999) Prototype microrobots for micro positioning in a manufacturing process and micro unmanned vehicles Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 570-575
Zhang W, Harsh KF, Michalicek MA, et al. (1999) Flip-chip assembly for RF and optical MEMS American Society of Mechanical Engineers, Eep. 26
Zhang W, Harsh KF, Michalicek MA, et al. (1999) Flip-chip assembly for RF and optical MEMS American Society of Mechanical Engineers, Eep. 26
Harsh KF, Lee Y. (1998) Modeling for solder self-assembled MEMS High-Power Lasers and Applications. 3289: 177-184
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