Kevin F. Harsh, Ph.D.
Affiliations: | 2001 | University of Colorado, Boulder, Boulder, CO, United States |
Area:
Mechanical EngineeringGoogle:
"Kevin Harsh"Parents
Sign in to add mentorYung-Cheng Lee | grad student | 2001 | CU Boulder | |
(Design optimization of MEMS solder self -assembly.) |
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Publications
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Lee YC, McCarthy B, Diao J, et al. (2003) Computer-aided design for microelectromechanical systems (MEMS) International Journal of Materials & Product Technology. 18: 356 |
Lee YC, McCarthy B, Diao J, et al. (2003) Computer-aided design for microelectromechanical systems (MEMS) International Journal of Materials and Product Technology. 18: 356-380 |
Harsh KF, Bright VM, Lee YC. (2001) Design optimization of surface micro-machined self-assembled MEMS structures Advances in Electronic Packaging. 1: 155-161 |
Harsh KF, Su B, Zhang W, et al. (2000) Realization and design considerations of a flip-chip integrated MEMS tunable capacitor Sensors and Actuators, a: Physical. 80: 108-118 |
Harsh KF, Bright VM, Lee YC. (2000) Study of micro-scale limits of solder self-assembly for MEMS Proceedings - Electronic Components and Technology Conference. 1690-1695 |
Harsh KF, Bright VM, Lee YC. (1999) Solder self-assembly for three-dimensional microelectromechanical systems Sensors and Actuators, a: Physical. 77: 237-244 |
Kladitis PE, Bright VM, Harsh KF, et al. (1999) Prototype microrobots for micro positioning in a manufacturing process and micro unmanned vehicles Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 570-575 |
Zhang W, Harsh KF, Michalicek MA, et al. (1999) Flip-chip assembly for RF and optical MEMS American Society of Mechanical Engineers, Eep. 26 |
Zhang W, Harsh KF, Michalicek MA, et al. (1999) Flip-chip assembly for RF and optical MEMS American Society of Mechanical Engineers, Eep. 26 |
Harsh KF, Lee Y. (1998) Modeling for solder self-assembled MEMS High-Power Lasers and Applications. 3289: 177-184 |