Ronald A. Coutu
Affiliations: | Electrical & Computer Engineering (ENG) | Air Force Institute of Technology |
Area:
Electronics and Electrical Engineering, NanotechnologyGoogle:
"Ronald Coutu"Children
Sign in to add trainee| Nathan E. Glauvitz | grad student | 2013 | Air Force Institute of Technology |
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Publications
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| Mahanta P, Anwar F, Coutu RA. (2019) Novel Test Fixture for Characterizing MEMS Switch Microcontact Reliability and Performance. Sensors (Basel, Switzerland). 19 |
| Nandy T, Coutu RA, Ababei C. (2018) Carbon Monoxide Sensing Technologies for Next-Generation Cyber-Physical Systems. Sensors (Basel, Switzerland). 18 |
| Ren W, Jiang N, Chang C, et al. (2017) Observation and Understanding of the Initial Unstable Electrical Contact Behaviors Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1272-1279 |
| Laurvick TV, Coutu RA. (2017) Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 345-353 |
| Coutu RA, Medvedev IR, Petkie DT. (2016) Improved Sensitivity MEMS Cantilever Sensor for Terahertz Photoacoustic Spectroscopy. Sensors (Basel, Switzerland). 16 |
| Laurvick TV, Coutu RA, Lake RA. (2016) Integrating nanosphere lithography in device fabrication Proceedings of Spie - the International Society For Optical Engineering. 9779 |
| Laurvick TV, Coutu RA, Sattler JM, et al. (2016) Surface feature engineering through nanosphere lithography Journal of Micro/Nanolithography, Mems, and Moems. 15: 031602 |
| Lafleur RS, Coutu RA. (2015) Hybrid multi-junction silicon solar cell simulation Proceedings of Spie - the International Society For Optical Engineering. 9358 |
| Lake RA, Coutu RA. (2015) Using Cross-Linked SU-8 to Flip-Chip Bond, Assemble, and Package MEMS Devices Ieee Transactions On Components, Packaging and Manufacturing Technology |
| Glauvitz NE, Coutu RA, Medvedev IR, et al. (2015) Terahertz photoacoustic spectroscopy using an MEMS cantilever sensor Journal of Microelectromechanical Systems. 24: 216-223 |