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Nikhilesh Chawla

Affiliations: 
2020 Mechanical Engineering Arizona State University, Tempe, AZ, United States 
 2020- Materials Engineering Purdue University, West Lafayette, IN, United States 
Area:
3D Materials Science, Mechanical Behavior, X-ray microscopy, Nanoindentation
Website:
https://engineering.purdue.edu/MSE/people/ptProfile?resource_id=239946
Google:
"Nikhilesh Chawla"
Bio:

https://engineering.purdue.edu/ChawlaResGroup
https://scholar.google.com/citations?user=m1sUzhMAAAAJ&hl=en
https://www.proquest.com/openview/3fd2dbcce810dfe8974b1f4bedf76fb6/1

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Parents

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John W. Holmes grad student 1997 University of Michigan
 (The high frequency fatigue behavior of continuous-fiber-reinforced ceramic matrix composites)
J. Wayne Jones post-doc 1997 University of Michigan

Children

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Ganesh V. Vasudevanpillai grad student 2004 Arizona State
Huiyang Fei grad student 2011 Arizona State
Robbie Adams grad student 2012 Arizona State
Huxiao Xie grad student 2012 Arizona State
Kyle Yazzie grad student 2012 Arizona State

Collaborators

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Scott N Roberts collaborator Arizona State
BETA: Related publications

Publications

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Gao T, Singaravelu AS, Oka S, et al. (2020) Powder bed packing and API content homogeneity of granules in single drop granule formation Powder Technology. 366: 12-21
Zhao Y, Singaravelu ASS, Ma X, et al. (2020) Micromechanical properties and deformation behavior of Al3BC/6061 Al composites via micropillar compression Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 773: 138852
Branch Kelly M, Kirubanandham A, Chawla N. (2020) Mechanisms of thermal cycling damage in polycrystalline Sn-rich solder joints Materials Science and Engineering: A. 771: 138614
Zhao Y, Singaravelu ASS, Ma X, et al. (2020) Mechanical properties of Al3BC by nanoindentation and micropillar compression Materials Letters. 264: 127361
Torbati-Sarraf H, Stannard TJ, La Plante EC, et al. (2020) Direct observations of microstructure-resolved corrosion initiation in AA7075-T651 at the nanoscale using vertical scanning interferometry (VSI) Materials Characterization. 161: 110166
Zhao Y, Singaravelu ASS, Ma X, et al. (2020) Unveiling the deformation behavior and strengthening mechanisms of Al3BC/Al composites via in-situ micropillar compression Journal of Alloys and Compounds. 823: 153842
Kelly MB, Niverty S, Chawla N. (2020) Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation Journal of Alloys and Compounds. 818: 152918
Yang L, Mayer C, Chawla N, et al. (2020) Nanomechanical characterization of the fracture toughness of Al/SiC nanolaminates Extreme Mechanics Letters. 40: 100945
Kelly MB, Niverty S, Chawla N. (2020) Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints Acta Materialia. 189: 118-128
Kelly MB, Maity T, Sakib ARN, et al. (2020) Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0) Journal of Electronic Materials. 49: 4466-4467
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