Tian Gu, Ph.D.
Affiliations: | 2012 | Department of Electrical and Computer Engineering | University of Delaware, Newark, DE, United States |
Area:
Electronics and Electrical Engineering, Electricity and Magnetism PhysicsGoogle:
"Tian Gu"Parents
Sign in to add mentor| Michael W. Haney | grad student | 2012 | University of Delaware | |
| (Chip-scale optical interconnects.) | ||||
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Publications
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| Aryana K, Kim HJ, Popescu CC, et al. (2023) Toward Accurate Thermal Modeling of Phase Change Material-Based Photonic Devices. Small (Weinheim An Der Bergstrasse, Germany). e2304145 |
| Su P, Shalaginov M, Gu T, et al. (2021) Large-area optical metasurface fabrication using nanostencil lithography. Optics Letters. 46: 2324-2327 |
| Zhang Y, Fowler C, Liang J, et al. (2021) Electrically reconfigurable non-volatile metasurface using low-loss optical phase-change material. Nature Nanotechnology |
| Shalaginov MY, An S, Zhang Y, et al. (2021) Reconfigurable all-dielectric metalens with diffraction-limited performance. Nature Communications. 12: 1225 |
| Shalaginov MY, An S, Yang F, et al. (2020) Single-Element Diffraction-Limited Fisheye Metalens. Nano Letters |
| Wang X, Yu S, Qin J, et al. (2020) Low-Voltage, Coupled Multiple Quantum Well Electroreflective Modulators Towards Ultralow Power Inter-Chip Optical Interconnects Journal of Lightwave Technology. 38: 3414-3421 |
| Yu S, Qiu X, Zuo H, et al. (2020) Compact and Fabrication-Tolerant Waveguide Bends Based on Quadratic Reflectors Journal of Lightwave Technology. 38: 4368-4373 |
| Yu S, Zuo H, Sun X, et al. (2020) Optical Free-Form Couplers for High-density Integrated Photonics (OFFCHIP): A Universal Optical Interface Journal of Lightwave Technology. 38: 3358-3365 |
| Zhang Y, Chou JB, Li J, et al. (2019) Broadband transparent optical phase change materials for high-performance nonvolatile photonics. Nature Communications. 10: 4279 |
| Li D, Michel J, Hu J, et al. (2019) Compact spectrum splitter for laterally arrayed multi-junction concentrator photovoltaic modules. Optics Letters. 44: 3274-3277 |