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Hong Shi, Ph.D.

Affiliations: 
2012 Chemical Engineering University of Utah, Salt Lake City, UT 
Area:
Chemical Engineering, General Engineering, Mechanical Engineering
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"Hong Shi"
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Terry A. Ring grad student 2012 University of Utah
 (Modeling pad wear and pad conditioning in chemical-mechanical polishing using population balance model.)

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Shi H, Ring TA. (2010) CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect Microelectronic Engineering. 87: 2368-2375
Shi H, Ring TA. (2010) Analytical solution for polish-rate decay in chemical-mechanical polishing Journal of Engineering Mathematics. 68: 207-211
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