Kyuchul Chong, Ph.D.
Affiliations: | 2005 | University of California, Los Angeles, Los Angeles, CA |
Area:
Materials Science Engineering, Electronics and Electrical EngineeringGoogle:
"Kyuchul Chong"Parents
Sign in to add mentor| Ya-Hong Xie | grad student | 2005 | UCLA | |
| (Three-dimensional impedance engineering for mixed-signal system -on -chip applications.) | ||||
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Publications
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| Zhang X, Xu C, Chong K, et al. (2011) Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits. Materials (Basel, Switzerland). 4: 952-962 |
| Chong K, Zhang X, Tu K, et al. (2005) Three-Dimensional Substrate Impedance Engineering Based on<tex>$hbox p ^-$</tex>/<tex>$hbox p ^+$</tex>Si Substrate for Mixed-Signal System-on-Chip (SoC) Ieee Transactions On Electron Devices. 52: 2440-2446 |
| Chong K, Xie YH. (2005) Low capacitance and high isolation bond pad for high-frequency RFICs Ieee Electron Device Letters. 26: 746-748 |
| Chong K, Xie YH. (2005) High-performance on-chip transformers Ieee Electron Device Letters. 26: 557-559 |
| Chong K, Xie Y, Yu K, et al. (2005) High-performance inductors integrated on porous silicon Ieee Electron Device Letters. 26: 93-95 |
| Kim HS, Chong K, Xie YH, et al. (2003) The Importance of Distributed Grounding in Combination with Porous Si Trenches for the Reduction of RF Crosstalk Through p- Si Substrate Ieee Electron Device Letters. 24: 640-642 |
| Kim H, Chong K, Xie Y. (2003) Study of the cross-sectional profile in selective formation of porous silicon Applied Physics Letters. 83: 2710-2712 |
| Kim H, Chong K, Xie Y. (2003) The promising role of porous Si in mixed-signal integrated circuit technology Physica Status Solidi (a). 197: 269-274 |