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Vinay Sriram, Ph.D.

Affiliations: 
2008 University of California, Los Angeles, Los Angeles, CA 
Area:
Materials Science Engineering
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"Vinay Sriram"
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Jenn-Ming Yang grad student 2008 UCLA
 (Processing and mechanical characterization of nano twinned copper by electrodeposition.)

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Sriram V, Yang JM, Ye J, et al. (2010) In-situ metrology and testing of nanotwinned copper pillars for potential air gap applications Microelectronic Engineering. 87: 2046-2049
Xu D, Sriram V, Ozolins V, et al. (2009) In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper Journal of Applied Physics. 105
Tong M, Sriram V, Minor A, et al. (2009) In situ and ex situ nanomechanical analysis of reactive nanolayer solder joints Advanced Engineering Materials. 11: 645-649
Xu D, Sriram V, Ozolins V, et al. (2008) Nanotwin formation and its physical properties and effect on reliability of copper interconnects Microelectronic Engineering. 85: 2155-2158
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