Pridhvi Dandu, D.E.
Affiliations: | 2012 | Mechanical Engineering | Lamar University - Beaumont |
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Mechanical EngineeringGoogle:
"Pridhvi Dandu"Parents
Sign in to add mentor| Xuejun Fan | grad student | 2012 | Lamar University - Beaumont | |
| (Coupled-field modeling of interconnect failure by electromigration in microelectronics systems.) | ||||
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| Dandu P, Fan XJ, Liu Y. (2010) Some remarks on finite element modeling of electromigration in solder joints Proceedings - Electronic Components and Technology Conference. 396-402 |
| Dandu P, Fan XJ, Liu Y, et al. (2010) Finite element modeling on electromigration of solder joints in wafer level packages Microelectronics Reliability. 50: 547-555 |