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Bowen Cheng, Ph.D.

Affiliations: 
2011 University of Washington, Seattle, Seattle, WA 
Area:
Electronics and Electrical Engineering
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"Bowen Cheng"
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Karl F. Böhringer grad student 2011 University of Washington
 (High-Density Spring Interconnects for High-Power Electronics Packaging.)

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Publications

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Cheng B, De Bruyker D, Chua C, et al. (2013) Microspring characterization and flip-chip assembly reliability Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 187-196
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