Taejoo Hwang, Ph.D.
Affiliations: | 2004 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Mechanical Engineering, Packaging Engineering, Electronics and Electrical EngineeringGoogle:
"Taejoo Hwang"Parents
Sign in to add mentorYoav Peles | grad student | 2004 | RPI | |
(Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring.) |