Jeong-Hyun Cho, Ph.D.
Affiliations: | 2007 | Washington State University, Pullman, WA, United States |
Area:
Mechanical Engineering, Materials Science EngineeringGoogle:
"Jeong-Hyun Cho"Parents
Sign in to add mentorCecilia D. Richards | grad student | 2007 | WSU | |
(Design, fabrication, and characterization of a MEMS thermal switch and integration with a dynamic micro heat engine.) |
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Publications
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Dai C, Lin Z, Agarwal K, et al. (2020) Self-Assembled 3D Nano-Split Rings for Plasmon-Enhanced Optofluidic Sensing. Nano Letters |
Hu J, Li L, Wang R, et al. (2020) Fabrication and Photoelectric Properties of a Graphene-Silicon Nanowire Heterojunction on a Flexible Polytetrafluoroethylene Substrate Materials Letters. 281: 128599 |
Joung D, Wratkowski D, Dai C, et al. (2018) Fabrication of Three-Dimensional Graphene-Based Polyhedrons via Origami-Like Self-Folding. Journal of Visualized Experiments : Jove |
Dai C, Agarwal K, Cho JH. (2018) Ion-Induced Localized Nanoscale Polymer Reflow for Three-Dimensional Self-Assembly. Acs Nano |
Cho J, Li X, Picraux ST. (2012) The effect of metal silicide formation on silicon nanowire-based lithium-ion battery anode capacity Journal of Power Sources. 205: 467-473 |
Cho JH, Hu S, Gracias DH. (2010) A three dimensional self-folding package (SFP) for electronics Materials Research Society Symposium Proceedings. 1249: 317-321 |
Hamdan A, Cho J, Johnson R, et al. (2009) Evaluation of a thermal interface material fabricated using thermocompression bonding of carbon nanotube turf. Nanotechnology. 21: 015702 |
Cho JH, Richards CD, Richards RF. (2008) A facility for characterizing the steady-state and dynamic thermal performance of microelectromechanical system thermal switches. The Review of Scientific Instruments. 79: 034901 |
Cho J, Richards C, Bahr D, et al. (2008) Evaluation of contacts for a MEMS thermal switch Journal of Micromechanics and Microengineering. 18: 105012 |
Cho J, Wiser T, Richards C, et al. (2007) Fabrication and characterization of a thermal switch Sensors and Actuators a: Physical. 133: 55-63 |