Siu W. Or, Ph.D.

Affiliations: 
2001 Hong Kong Polytechnic University (Hong Kong) 
Area:
Materials Science Engineering, Packaging Engineering, Electronics and Electrical Engineering, Mechanical Engineering
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"Siu Or"

Parents

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Helen L. Wa Chan-Wong grad student 2001 Hong Kong Polytechnic University (Hong Kong)
 (High frequency transducer for ultrasonic bonding.)
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Publications

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Huang X, Or SW. (2019) Unique electromagnetic loss properties of Co-doped ZnO Nanofiber Materials Letters. 238: 271-274
Zhang M, Or SW. (2018) Gradient-Type Magnetoelectric Current Sensor with Strong Multisource Noise Suppression. Sensors (Basel, Switzerland). 18
Wang J, Or SW, Tan J. (2018) Enhanced microwave electromagnetic properties of core/shell/shell-structured Ni/SiO2/polyaniline hexagonal nanoflake composites with preferred magnetization and polarization orientations Materials & Design. 153: 190-202
Wu Y, Or SW. (2018) Thickness-dependent structural and electromechanical properties of (Na0.85K0.15)0.5Bi0.5TiO3 multilayer thin film-based heterostructures Materials & Design. 149: 153-164
Zhang M, Or SW. (2017) Magnetoelectric Transverse Gradient Sensor with High Detection Sensitivity and Low Gradient Noise. Sensors (Basel, Switzerland). 17
Sun Y, Pan Z, Long H, et al. (2017) Urchin-Like Ni Microspherical Structure with Enhanced Magnetic Loss for Thin Microwave Absorber at Gigahertz Nano. 12: 1750034
Zhang M, Or SW. (2017) Phase-sensitive dc magnetometer based on magnetic–electromagnetic–magnetostrictive–piezoelectric heterostructure Aip Advances. 7: 56642
Cui C, Zhou P, Liu X, et al. (2017) Ag3PO4 nanoparticle-decorated Ni/C nanocapsules with tunable electromagnetic absorption properties Aip Advances. 7: 56421
Wang J, Zhu P, Wang J, et al. (2017) Interchange core/shell assembly of diluted magnetic semiconductor CeO2 and ferromagnetic ferrite Fe3O4 for microwave absorption Aip Advances. 7: 055811
Feng C, Liu X, Or SW, et al. (2017) Exchange coupling and microwave absorption in core/shell-structured hard/soft ferrite-based CoFe2O4/NiFe2O4 nanocapsules Aip Advances. 7: 56403
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