Jeffrey M. Snodgrass, Ph.D.
Affiliations: | 2002 | Stanford University, Palo Alto, CA |
Area:
Materials Science EngineeringGoogle:
"Jeffrey Snodgrass"Parents
Sign in to add mentorReinhold H. Dauskardt | grad student | 2002 | Stanford | |
(The effect of fatigue and environment on the adhesion and delamination of thin polymer films.) |
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Publications
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Snodgrass JM, Pantelidis D, Jenkins ML, et al. (2002) Subcritical debonding of polymer/silica interfaces under monotonic and cyclic loading Acta Materialia. 50: 2395-2411 |
Jenkins M, Snodgrass J, Chesterman A, et al. (2001) Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging Mrs Proceedings. 682 |
Lane MW, Snodgrass JM, Dauskardt RH. (2001) Environmental Effects on Interfacial Adhesion Microelectronics Reliability. 41: 1615-1624 |
Lane MW, Snodgrass JM, Dauskardt RH. (2001) Invited paper environmental effects on interfacial adhesion Microelectronics Reliability. 41: 1615-1624 |
Jenkins M, Snodgrass J, Chesterman A, et al. (2000) Atomic Force Microscopy Studies of Fracture Surfaces From Oxide / Polymer Interfaces Mrs Proceedings. 654 |
Snodgrass JM, Dauskardt RH. (2000) The effect of fatigue on the adhesion and subcritical debonding of benzocyclobutene/silicon dioxide interfaces Materials Research Society Symposium - Proceedings. 612 |
Panteliidis D, Snodgrass J, Dauskardt RH, et al. (1999) Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions Mrs Proceedings. 594: 407 |
Snodgrass JM, Pantelidis D, Bravman JC, et al. (1999) The Effects of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers Mrs Proceedings. 565: 123 |
Snodgrass JM, Pantelidis D, Bravman JC, et al. (1999) The effects of environment and fatigue on the adhesion and subcritical debonding of dielectric polymers Materials Research Society Symposium - Proceedings. 565: 123-128 |
Snodgrass JM, Hotchkiss G, Dauskardt RH. (1998) Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging Mrs Proceedings. 515: 37 |