Eric P. Guyer, Ph.D.

Affiliations: 
2005 Stanford University, Palo Alto, CA 
Area:
Materials Science Engineering, Electronics and Electrical Engineering, Physical Chemistry
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"Eric Guyer"

Parents

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Reinhold H. Dauskardt grad student 2005 Stanford
 (The effects of aqueous solution chemistry on the fracture of nanoporous thin-films.)
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Publications

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Han SM, Guyer EP, Nix WD. (2011) Extracting thin film hardness of extremely compliant films on stiff substrates Thin Solid Films. 519: 3221-3224
Guyer EP, Gantz J, Dauskardt RH. (2007) Aqueous solution diffusion in hydrophobic nanoporous thin-film glasses Journal of Materials Research. 22: 710-718
Houle FA, Guyer E, Miller DC, et al. (2007) Adhesion between template materials and UV-cured nanoimprint resists Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 25: 1179
Guyer EP, Patz M, Dauskardt RH. (2006) Fracture of nanoporous methyl silsesquioxane thin-film glasses Journal of Materials Research. 21: 882-894
Gage DM, Guyer EP, Stebbins JF, et al. (2006) UV curing effects on glass structure and mechanical properties of organosilicate low-k thin films 2006 International Interconnect Technology Conference, Iitc. 149-151
Iacopi F, Travaly Y, Eyckens B, et al. (2006) Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation Journal of Applied Physics. 99
Iacopi F, Waldfried C, Houthoofd K, et al. (2006) UV -assisted curing: An effective technique for toughening low-k organosilicate films Advanced Metallization Conference (Amc). 247-254
Guyer EP, Dauskardt RH. (2005) Effect of solution pH on the accelerated cracking of nanoporous thin-film glasses Journal of Materials Research. 20: 680-687
Guyer EP, Dauskardt RH. (2005) Effect of porosity on reducing cohesive strength and accelerating crack growth in ultra low-k thin-films Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 223-225
Guyer EP, Dauskardt RH. (2005) Accelerated debonding and cracking in thin-film structures: Chemical reaction rate and loading effects 11th International Conference On Fracture 2005, Icf11. 8: 6111-6116
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