Eric J. Buchovecky, Ph.D.
Affiliations: | 2010 | Brown University, Providence, RI |
Area:
Applied Mechanics, Materials Science Engineering, Mechanical EngineeringGoogle:
"Eric Buchovecky"Parents
Sign in to add mentor| Allan Bower | grad student | 2010 | Brown | |
| (Numerical simulation of stress generation and whisker growth in tin films.) | ||||
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Publications
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| Pei F, Buchovecky E, Bower A, et al. (2017) Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments Acta Materialia. 129: 462-473 |
| Pei F, Jadhav N, Buchovecky E, et al. (2016) In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation Journal of Applied Physics. 119 |
| Chason E, Jadhav N, Pei F, et al. (2013) Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms Progress in Surface Science. 88: 103-131 |
| Jadhav N, Buchovecky EJ, Reinbold L, et al. (2010) Understanding the correlation between intermetallic growth, stress evolution, and Sn whisker nucleation Ieee Transactions On Electronics Packaging Manufacturing. 33: 183-192 |
| Jadhav N, Buchovecky E, Chason E, et al. (2010) Real-time SEM/FIB studies of whisker growth and surface modification Jom. 62: 30-37 |
| Buchovecky EJ, Du N, Bower AF. (2009) A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion Applied Physics Letters. 94 |
| Buchovecky E, Jadhav N, Bower AF, et al. (2009) Finite element modeling of stress evolution in Sn films due to growth of the Cu 6Sn 5 intermetallic compound Journal of Electronic Materials. 38: 2676-2684 |