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S P. Murarka

Affiliations: 
Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Materials Science Engineering
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"S Murarka"
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Sridhar K. Kailasam grad student 2000 RPI
Pei-I Wang grad student 2001 RPI

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Wang PI, Juneja JS, Murarka SP, et al. (2006) Stability of Cu on epoxy siloxane polymer under bias temperature stress Journal of the Electrochemical Society. 153
Murarka SP. (2005) Diffusion barriers in semiconductor devices/circuits Diffusion Processes in Advanced Technological Materials. 239-281
Wang PI, Juneja JS, Murarka S, et al. (2004) Novel epoxy siloxane polymer as low-k dielectric Materials Research Society Symposium Proceedings. 812: 31-36
Mallikarjunan A, Murarka SP, Lu TM. (2004) Separation of copper ion-induced and intrinsic polymer instabilities in polyarylether using triangular voltage sweep Journal of Applied Physics. 95: 1216-1221
Mallikarjunan A, Juneja J, Yang G, et al. (2002) The Effect of Interfacial Chemistry on Metal Ion Penetration into Polymeric Films Mrs Proceedings. 734
Mallikarjunan A, Murarka SP, Lu TM. (2002) Mobile ion detection in organosiloxane polymer using triangular voltage sweep Journal of the Electrochemical Society. 149
Cui H, Bhat IB, Murarka SP, et al. (2002) Copper drift in methyl-doped silicon oxide film Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 1987-1993
Lu H, Cui H, Bhat I, et al. (2002) Characterization of methyl-doped silicon oxide film deposited using Flowfill™ chemical vapor deposition technology Journal of Vacuum Science & Technology B. 20: 828-833
Wang PI, Murarka SP, Kaminski DA, et al. (2001) Surface Segregation of Al of the Bilayers of Pure Cu and Cu-Al Alloy Films Journal of the Electrochemical Society. 148
Wang PI, Murarka SP, Yang GR, et al. (2001) Evolution of the Cu-Al Alloy/SiO2 Interfaces during Bias Temperature Stressing Journal of the Electrochemical Society. 148
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