Tz-Cheng Chiu, Ph.D.
Affiliations: | 2000 | Lehigh University, Bethlehem, PA, United States |
Area:
Applied Mechanics, Mechanical Engineering, Materials Science EngineeringGoogle:
"Tz-Cheng Chiu"Parents
Sign in to add mentor| Fazil Erdogan | grad student | 2000 | Lehigh University | |
| (Buckling of graded coatings: A continuum model.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Tsai SW, Chiu TC, Chue CH. (2014) Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium Journal of Engineering Mathematics. 87: 123-137 |
| Lai YS, Chen CH, Chiu T. (2014) Analysis of fatigue delamination growth in flip-chip package Acta Mechanica. 225: 2761-2773 |
| Chiu T, Huang HW, Lai YS. (2011) Warpage evolution of overmolded ball grid array package during post-mold curing thermal process Microelectronics Reliability. 51: 2263-2273 |
| Chiu T, Edwards D, Ahmad M. (2010) Ball Grid Array Solder Joint Reliability Under System-Level Compressive Load Ieee Transactions On Device and Materials Reliability. 10: 324-337 |
| Chiu T, Lin H. (2009) Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique International Journal of Fracture. 156: 75-96 |
| Chiu T, Lin H. (2008) On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis Ieee Transactions On Components and Packaging Technologies. 31: 388-398 |
| Erdogan F, Chiu T. (2003) Plane Strain And Axisymmetric Spallation Of Graded Coatings Under Thermal Loading Journal of Thermal Stresses. 26: 497-523 |
| Chiu T, Erdogan F. (2003) Debonding of graded coatings under in-plane compression International Journal of Solids and Structures. 40: 7155-7179 |
| Chiu T, Erdogan F. (1999) One-Dimensional Wave Propagation In A Functionally Graded Elastic Medium Journal of Sound and Vibration. 222: 453-487 |