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Dae-Lok Bae, Ph.D.

Affiliations: 
2004 Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Chemical Engineering
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"Dae-Lok Bae"
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Timothy S. Cale grad student 2004 RPI
 (Low -resistivity, adherent tantalum for copper/low-k interconnects.)

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Publications

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Senkevich JJ, Karabacak T, Bae DL, et al. (2006) Formation of body-centered-cubic tantalum via sputtering on low- κ dielectrics at low temperatures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 534-538
Kim YS, Bae DI, Yang H, et al. (2005) Direct copper electroless deposition on a tungsten barrier Layer for ultralarge scale integration Journal of the Electrochemical Society. 152
Bae DL, Jezewski C, Cale TS, et al. (2005) Adhesion of sputter-deposited Ta to porous-methyl silsesquioxane pore sealed with molecular caulk Chemical Vapor Deposition. 11: 191-194
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