Rao R Tummala
Affiliations: | Georgia Institute of Technology, Atlanta, GA |
Area:
Electronics and Electrical EngineeringWebsite:
https://ece.gatech.edu/directory/rao-r-tummalaGoogle:
"Rao R Tummala"Bio:
https://ieeexplore.ieee.org/author/37275355800
https://hdl.handle.net/2142/62140
https://www.proquest.com/openview/2bcd99107cb5d84eb9a209357bd6d618/1
Parents
Sign in to add mentor| Arthur Leroy Friedberg | grad student | 1969 | UIUC | |
| (Thermal Expansion, Internal Stress, and Strength of Glass-Crystal Composites) | ||||
Children
Sign in to add trainee| Premjeet Chahal | grad student | (Philosophy Tree) | |
| Joseph M. Hobbs | grad student | 2002 | Georgia Tech |
| Devarajan Balaraman | grad student | 2005 | Georgia Tech |
| Ankur Aggarwal | grad student | 2006 | Georgia Tech |
| Shubhra Bansal | grad student | 2006 | Georgia Tech |
| Sau W. Koh | grad student | 2009 | Georgia Tech |
| Venkatesh Sundaram | grad student | 2009 | Georgia Tech |
BETA: Related publications
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Publications
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| Nimbalkar P, Bhaskar P, Kathaperumal M, et al. (2023) A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers. 15 |
| Dwarakanath S, Raj PM, Kondekar N, et al. (2020) Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects Journal of Vacuum Science & Technology A. 38: 033210 |
| Zhang R, Liu F, Kathaperumal M, et al. (2020) Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 393-399 |
| Gupte O, Murtagian G, Tummala R, et al. (2020) Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 828-835 |
| Sun T, Sharma H, Raj PM, et al. (2020) Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 134-141 |
| Lee H, Smet V, Tummala R. (2020) A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues Ieee Journal of Emerging and Selected Topics in Power Electronics. 8: 239-255 |
| Wang Y, Watanabe AO, Ogura N, et al. (2020) Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration Journal of Electronic Materials. 1-9 |
| Ogura N, Ravichandran S, Shi T, et al. (2019) First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications International Symposium On Microelectronics. 2019: 000202-7 |
| Spurney RG, Sharma H, Raj PM, et al. (2019) 3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1466-1472 |
| Sato Y, Imajyo N, Ishikawa K, et al. (2019) Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass Journal of Materials Science: Materials in Electronics. 30: 10183-10190 |