Jong-Seung Park, Ph.D.
Affiliations: | 2006 | Arizona State University, Tempe, AZ, United States |
Area:
Mechanical Engineering, Packaging EngineeringGoogle:
"Jong-Seung Park"Parents
Sign in to add mentor| Ampere A. Tseng | grad student | 2006 | Arizona State | |
| (Characterization of transmission laser bonding (TLB) technique for microsystem packaging.) | ||||
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Publications
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| Park J, Zhu H, Zhao Z, et al. (2007) Direct Writing of Spot and Line Bonds for Microsystem Packaging Using Transmission Laser Bonding Technique Materials and Manufacturing Processes. 22: 71-80 |
| Tseng AA, Park JS, Vakanas GP, et al. (2007) Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging Microsystem Technologies. 13: 49-59 |
| Tseng AA, Park J. (2006) Effects of surface roughness and contact pressure on wafer bonding strength using transmission laser bonding technique Journal of Micro-Nanolithography Mems and Moems. 5: 43013 |
| Tseng AA, Park J. (2006) Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging Ieee Transactions On Electronics Packaging Manufacturing. 29: 308-318 |
| Tseng AA, Park J. (2006) Mechanical Strength and Interface Characteristics of Transmission Laser Bonding Ieee Transactions On Electronics Packaging Manufacturing. 29: 191-201 |
| Tseng AA, Insua IA, Park J, et al. (2005) Milling yield estimation in focused ion beam milling of two-layer substrates Journal of Micromechanics and Microengineering. 15: 20-28 |