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Peter A. Kottke, Ph.D.

Affiliations: 
2004 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering
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"Peter Kottke"
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Ward O. Winer grad student 2004 Georgia Tech
 (Rheological implications of tension in liquids.)

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Publications

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Lee JY, Kottke PA, Fedorov AG. (2020) Electrohydrodynamics of Gas Assisted Electrospray Ionization Mass Spectrometry. Journal of the American Society For Mass Spectrometry
Chapman JD, Kottke PA, Fedorov AG. (2019) Enhanced thin film evaporation via impinging electrospray liquid jets with entrained air streaming International Journal of Heat and Mass Transfer. 131: 85-95
Limia A, Kottke P, Fedorov AG, et al. (2018) Thermal modeling and efficiency of a dual-stage sodium heat engine Applied Thermal Engineering. 145: 603-609
Kottke PA, Lee JY, Jonke AP, et al. (2017) DRILL: An ESI-MS interface for improved sensitivity via inertial droplet sorting and electrohydrodynamic focusing in a swirling flow. Analytical Chemistry
Nasr MH, Green CE, Kottke PA, et al. (2017) Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps Journal of Electronic Packaging. 139
Sarvey TE, Hu Y, Green CE, et al. (2017) Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1465-1475
Anderson DM, Yun TM, Kottke PA, et al. (2017) Comprehensive Analysis of Sorption Enhanced Steam Methane Reforming in a Variable Volume Membrane Reactor Industrial & Engineering Chemistry Research. 56: 1758-1771
Nasr MH, Green CE, Kottke PA, et al. (2017) Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps International Journal of Heat and Mass Transfer. 108: 1702-1713
Narayanan S, Kottke PA, Joshi YK, et al. (2016) GAS-ASSISTED EVAPORATION HEAT AND MASS TRANSFER Annual Review of Heat Transfer. 19: 159-198
Zhang X, Han X, Sarvey TE, et al. (2016) Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications Journal of Electronic Packaging, Transactions of the Asme. 138
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