Guo-Quan Lu
Affiliations: | Virginia Polytechnic Institute and State University, Blacksburg, VA, United States |
Area:
Packaging Engineering, Materials Science Engineering, Electronics and Electrical EngineeringGoogle:
"Guo-Quan Lu"Children
Sign in to add trainee| Shatil Haque | grad student | 2000 | Virginia Tech |
| Xingsheng Liu | grad student | 2001 | Virginia Tech |
| Sihua Wen | grad student | 2002 | Virginia Tech |
| Guofeng Bai | grad student | 2005 | Virginia Tech |
| Jesus N. Calata | grad student | 2005 | Virginia Tech |
| Kewei Xiao | grad student | 2013 | Virginia Tech |
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Publications
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| Liu L, Ngo KD, Lu G. (2021) Effects of SiO2 inclusions on sintering and permeability of NiCuZn ferrite for additive manufacturing of power magnets Journal of the European Ceramic Society. 41: 466-471 |
| Li D, Mei Y, Xin Y, et al. (2020) Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature Ieee Transactions On Power Electronics. 35: 12646-12650 |
| Zhang X, Wang M, Li X, et al. (2020) A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules Ieee Transactions On Power Electronics. 35: 8532-8539 |
| Liu J, Mei Y, Lu S, et al. (2020) Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC–DC Converter Ieee Transactions On Power Electronics. 35: 826-834 |
| Ding C, Liu L, Moss J, et al. (2020) Reliability Assessment of Magnetic Cores and 3-D-Printed Constant-Flux Inductors Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1693-1699 |
| Jin J, Mei Y, Chen G, et al. (2020) Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 982-989 |
| Liu L, Nam D, Guo B, et al. (2020) Glass for Encapsulating High Temperature Power Modules Ieee Journal of Emerging and Selected Topics in Power Electronics. 1-1 |
| DiMarino C, Mouawad B, Johnson CM, et al. (2020) Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module Ieee Journal of Emerging and Selected Topics in Power Electronics. 8: 381-394 |
| Tan Y, Li X, Chen G, et al. (2020) Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint International Journal of Adhesion and Adhesives. 97: 102488 |
| Ding C, Mei Y, Ngo KDT, et al. (2019) A (Permalloy + NiZn Ferrite) Moldable Magnetic Composite for Heterogeneous Integration of Power Electronics. Materials (Basel, Switzerland). 12 |