Hai Ding, Ph.D.
Affiliations: | 2003 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Packaging EngineeringGoogle:
"Hai Ding"Parents
Sign in to add mentor| I Charles Ume | grad student | 2003 | Georgia Tech | |
| (Prediction and validation of thermomechanical reliability in electronic packaging.) | ||||
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Publications
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| Ding H, Ume IC, Zhang J, et al. (2005) Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study Ieee Transactions On Instrumentation and Measurement. 54: 1898-1904 |
| Ding H, Ume IC, Powell RE, et al. (2005) Parametric study of warpage in printed wiring board assemblies Ieee Transactions On Components and Packaging Technologies. 28: 517-524 |
| Ding H, Ume IC, Zhang C. (2004) Warpage Analysis of Underfilled Wafers Journal of Electronic Packaging. 126: 265-270 |
| Ding H, Powell RE, Hanna CR, et al. (2002) Warpage measurement comparison using shadow moiré and projection moiré methods Ieee Transactions On Components and Packaging Technologies. 25: 714-721 |