Mehdi Asheghi
Affiliations: | Carnegie Mellon University, Pittsburgh, PA |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Mehdi Asheghi"Children
Sign in to add trainee| Yizhang Yang | grad student | 2005 | Carnegie Mellon |
| Keivan Etessam Yazdani | grad student | 2006 | Carnegie Mellon |
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Perez C, McLeod AJ, Chen ME, et al. (2023) High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature. Acs Nano |
| Khan AI, Wu X, Perez C, et al. (2022) Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance. Nano Letters |
| Liu T, Asheghi M, Goodson KE. (2022) Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation. Langmuir : the Acs Journal of Surfaces and Colloids. 38: 221-230 |
| Kwon H, Perez C, Park W, et al. (2021) Thermal Characterization of Metal-Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers. Acs Applied Materials & Interfaces |
| Kwon H, Khan AI, Perez C, et al. (2021) Uncovering Thermal and Electrical Properties of SbTe/GeTe Superlattice Films. Nano Letters |
| Kwon H, Perez C, Kim HK, et al. (2021) Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces |
| Kim Y, Kwon H, Han HS, et al. (2020) Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces |
| Jung KW, Hazra S, Kwon H, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling Journal of Electronic Packaging. 142 |
| Hazra S, Jung KW, Iyengar M, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Journal of Electronic Packaging. 142 |
| Jung KW, Cho E, Lee H, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa Journal of Electronic Packaging. 142 |